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Subject:
Re: ??: Re: [TN] BGA soldering open issue
From:
John Goulet <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Sun, 7 Dec 2008 14:40:37 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (441 lines) 
Please copy me when you send the pictures. I never realized that BGA heatsinks could cause these issues. I figures the experts that designed BGA heatsinks made sure they wouldn't decrease reliability. As a contract assembler we would assume the failed BGA was from either the BGA mfg or something in our process and therefore repair as the board under warrantee.

-------------- Original message -------------- 
From: Victor Hernandez <[log in to unmask]> 

> Werner, 
> 
> Could I also get copied on the moiré pictures? Supported data as such is 
> always interesting. 
> 
> vic. 
> 
> -----Original Message----- 
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner engelmaier 
> Sent: Friday, December 05, 2008 2:11 PM 
> To: [log in to unmask] 
> Subject: Re: [TN] ??: Re: [TN] BGA soldering open issue 
> 
> 
> Hi Arnaud, 
> A BGA with an attached heatsink is causing the BGA to be thermally 
> unsymmetrical--and you get warpage by the 'bimetallic strip' effect. 
> I show some nice shadow moire pictures [courtesy Advanced Semiconductor 
> Engineering Inc.] showing 9 mils of warpage fro 20 to 240°C in my workshops. 
> 
> Werner 
> 
> 
> 
> 
> 
> 
> 
> -----Original Message----- 
> From: Arnaud Grivon 
> To: Werner engelmaier 
> Sent: Fri, 5 Dec 2008 9:21 am 
> Subject: Re: [TN] 答复: Re: [TN] BGA soldering open issue 
> 
> 
> 
> 
> 
> 
> 
> 
> 
> Hello Werner, 
>  
> 
> Could you please elaborate on your posting stating that BGAs with 
> heatsinks are more prone to warpage during assembly? 
> 
> Are you thinking of cavity down BGA (such as SBGA), FC-PBGA, or...? 
> 
> Would you have any publication/article to share? 
> 
> I thank you in advance for your support. 
> 
> Best regards, 
>  
> 
> Arnaud Grivon 
>  
> 
> Werner engelmaier a écrit : 
> 
> > Nee hao Hechong, 
> 
> > BGAs with heatsinks have been shown to warp and thus loading the SJs in 
> tension. 
> 
> > 
> 
> > Werner 
> 
> > 
> 
> > 
> 
> > 
> > 
> 
> > 
> 
> > 
> > 
> 
> > -----Original Message----- 
> 
> > From: Cong He  
> 
> > To: [log in to unmask] 
> 
> > Sent: Thu, 4 Dec 2008 10:08 pm 
> 
> > Subject: [TN] 答复: Re: [TN] BGA soldering open issue 
> 
> > 
> 
> > 
> 
> > 
> 
> > 
> 
> > 
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> > 
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> > 
> 
> > 
> 
> > 
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> > 
> 
> > surface fin 
> ish is hasl. 
> > 
> 
> > after analysed parts of the board, we found some balls of the bga rupture. 
> 
> > Could it be the material of the ball(BGA) cause the problem? 
> 
> > 
> 
> > by the way, there is a heatsink which is double size lager than the chip 
> > stick on it without other fixture. 
> 
> > will the heatsink be the reason? 
> 
> > 
> 
> > 
> 
> > 
> 
> > 
> 
> > 
> 
> > 
> 
> > Hechong 
> 
> > 
> 
> > 
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> > 
> 
> > 
> 
> > 
> 
> > "Wenger, George M." 
> > 发件人: TechNet  
> 
> > 2008-12-05 10:57 
> 
> > 请答复 给 
> 
> > TechNet E-Mail Forum ; 请答复 给 
> 
> > "Wenger, George M."  
> 
> > 
> 
> > 
> 
> > 收件人 
> 
> > [log in to unmask] 
> 
> > 抄送 
> 
> > 
> 
> > 主题 
> 
> > Re: [TN] BGA soldering open issue 
> 
> > 
> 
> > 
> 
> > 
> 
> > 
> 
> > 
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> > 
> 
> > What is the surface finish on your PCBA? 
> 
> > 
> 
> > 
> 
> > 
> 
> > Necong, 
> 
> > 
> 
> > What is the surface finish on your PCBA? 
> 
> > 
> 
> > Regards, 
> 
> > George 
> 
> > George M. Wenger 
> 
> > Andrew Wireless Solutions 
> 
> > Senior Principal FMA / Reliability Engineer 
> 
> > 40 Technology Drive, Warren, NJ 07059 
> 
> > (908) 546-4531 [Office] (732) 309-8964 [Cell] 
> 
> > [log in to unmask] 
> 
> > 
> > 
> 
> > -----Original Message----- 
> 
> > From 
> : TechNet [mailto:[log in to unmask]] On Behalf Of Cong He 
> 
> > Sent: Thursday, December 04, 2008 9:09 PM 
> 
> > To: [log in to unmask] 
> 
> > Subject: [TN] BGA soldering ope 
> 
> > n issue 
> 
> > 
> 
> > dear all: 
> 
> > 
> 
> > I am facing a problem of bga soldering. 
> 
> > 
> 
> > when the board have just soldered ,it pass all test. 
> 
> > But after sometime, maybe for a few weeks, 
> 
> > some of the bga balls opened. the function became normal if i press the 
> > chip on the top side. 
> 
> > 
> 
> > It seems that the pcb didn't warp much,it seems even no warp at all. 
> 
> > Does any of you know why? And how to improve? 
> > 
> 
> > 
> 
> > 
> 
> > 
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> > 
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> > 
> 
> > Hechong 
> 
> > 
> 
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