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Subject:	Re: BGA soldering open issue
From:	"David D. Hillman" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:	Fri, 5 Dec 2008 07:31:18 -0600
Content-Type:	text/plain
Parts/Attachments:	text/plain (75 lines)

Hello! A couple of informational questions: (1) Are you using a tin/lead 
soldering process or a leadfree soldering process?; (2) What is the 
soldersphere alloy on the BGA - tin/lead or leadfree?

Dave Hillman
Rockwell Collins
[log in to unmask]




Cong He <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
12/04/2008 08:08 PM
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TechNet E-Mail Forum <[log in to unmask]>; Please respond to
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Subject
[TN] BGA soldering open issue






dear all:

I am facing a problem of bga soldering.

when the board have just soldered ,it pass all test.
But after sometime, maybe for a few weeks,
some of the bga balls opened. the function became normal if i press the 
chip on the top side.

It seems that the pcb didn't warp much,it seems even no warp at all.
Does any of you know why? And how to improve? 






Hechong

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