surface finish is hasl.
after analysed parts of the board, we found some balls of the bga rupture.
Could it be the material of the ball(BGA) cause the problem?
by the way, there is a heatsink which is double size lager than the chip
stick on it without other fixture.
will the heatsink be the reason?
Hechong
"Wenger, George M." <[log in to unmask]>
发件人: TechNet <[log in to unmask]>
2008-12-05 10:57
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Re: [TN] BGA soldering open issue
What is the surface finish on your PCBA?
Necong,
What is the surface finish on your PCBA?
Regards,
George
George M. Wenger
Andrew Wireless Solutions
Senior Principal FMA / Reliability Engineer
40 Technology Drive, Warren, NJ 07059
(908) 546-4531 [Office] (732) 309-8964 [Cell]
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Cong He
Sent: Thursday, December 04, 2008 9:09 PM
To: [log in to unmask]
Subject: [TN] BGA soldering open issue
dear all:
I am facing a problem of bga soldering.
when the board have just soldered ,it pass all test.
But after sometime, maybe for a few weeks,
some of the bga balls opened. the function became normal if i press the
chip on the top side.
It seems that the pcb didn't warp much,it seems even no warp at all.
Does any of you know why? And how to improve?
Hechong
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