Hi David,
The cooling rate should be 1.5°/s or lower comes from a requirement of HP.
The minimum solder temperature of SAC305/405 is 238°C is non-sensical without any details. Given enough time you can solder just above Liquidus; for reflow soldering you need to consider the heat transfer details and wat its you are soldering to.

Werner
  

 


 

-----Original Message-----
From: David Tremmel <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, 4 Dec 2008 4:57 pm
Subject: [TN] Lead free soldering










Hello Technetters,

 

Can anyone let me know where I can get a copy of a whitepaper or report that
states that the minimum solder temperature of SAC305/405 is 238°C (17°C over
liquidus) and the cooling rate should be 1.5°/s or lower.

 

 

Thank you in advance,

 

David Tremmel

Value Recovery

 <http://valurecovery.com/> http://ValuRecovery.com

 

 


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