Glad to see you had the yen to be in the right spirits this time of
year.
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Paul Reid
Sent: Wednesday, December 03, 2008 9:25 AM
To: [log in to unmask]
Subject: Re: [TN] Conductive Epoxy filled Vias
Hi Dave,
For consideration:
Epoxy filled vias usually have a reliability impact. Well fabricated
filled vias, with the right fill, produces no real reliability concern.
Poorly fabricated (aggressive planerization, button plating with
registration issues etc.) or with certain epoxy/material combinations,
the interconnection reliability may be reduced. Failures include
interconnection failures (barrel cracks, butt joint failures etc.) and
material damage (eyebrow delamination etc.). These concerns are
applicable to all interconnection types including through hole, bind and
buried. As expected lead-free assembly exacerbates (this word was added
for Dewey's sake) the reliability impact.
Sincerely,
Paul Reid
Program Coordinator
PWB Interconnect Solutions Inc.
235 Stafford Rd., West, Unit 103
Nepean, Ontario
Canada, K2H 9C1
613 596 4244 ext. 229
Skype paul_reid_pwb
[log in to unmask] <mailto:[log in to unmask]>
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dave Connitt
Sent: Tuesday, December 02, 2008 9:07 AM
To: [log in to unmask]
Subject: [TN] Conductive Epoxy filled Vias
Hello List,
We are considering implementing a 0.80 mm pitch BGA on a development
project and I have question about escape vias.
The part manufacturer recommends that we use a 0.019" pad with a 0.010"
drill. The board has to be a IPC-6012 class 3 PWB and I would like to
have a 0.003 annular ring on the escape vias.
One of our board vendors suggested we use a epoxy filled via which would
relieve us of the annular ring issue but I am not sure about still being
a class 3 board. Does anybody know where I can confirm that epoxy filled
vias are acceptable in a class 3 board?
Thanks,
Dave Connitt CID+
Printed Circuit Designer
KDI Precision Products, Inc.
A Wholly Owned Subsidiary of:
L3 Communications
3975 McMann Road
Cincinnati, Ohio 45245
Ph. 513- 943-2010 Fax 513-943-2288
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