Thanks Phil,
That is certainly reassuring.
Dave Connitt

-----Original Message-----
From: Phil Nutting [mailto:[log in to unmask]] 
Sent: Tuesday, December 02, 2008 9:32 AM
To: TechNet E-Mail Forum; Connitt, Dave @ KDI
Subject: RE: Conductive Epoxy filled Vias

Dave,

I can't tell you if it acceptable on a Class 3 board, but I can tell you
that we used conductive epoxy successfully as a fix on some development
boards that had an error.  It "connected" the necessary internal layers
and made the development boards work so we could continue testing.

Phil

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dave Connitt
Sent: Tuesday, December 02, 2008 9:07 AM
To: [log in to unmask]
Subject: [TN] Conductive Epoxy filled Vias

Hello List,
We are considering implementing a 0.80 mm pitch BGA on a development
project and I have question about escape vias.
The part manufacturer recommends that we use a 0.019" pad with a 0.010"
drill. The board has to be a IPC-6012 class 3 PWB and I would like to
have a 0.003 annular ring on the escape vias.
One of our board vendors suggested we use a epoxy filled via which would
relieve us of the annular ring issue but I am not sure about still being
a class 3 board. Does anybody know where I can confirm that epoxy filled
vias are acceptable in a class 3 board?
Thanks,

Dave Connitt CID+
Printed Circuit Designer
KDI Precision Products, Inc.
A Wholly Owned Subsidiary of:
L3 Communications
3975 McMann Road
Cincinnati, Ohio 45245
Ph. 513- 943-2010   Fax 513-943-2288

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