Hi Rex! Ah, it is good to be a material engineering these days as we don't 
need to learn anything new, we just dig up old data sets! There have been 
some good published work on tin pest in the last couple of years. In fact, 
Dr. Chris Hunt of the NPL has done some of the newest cutting edge work. I 
recommend you go to the NPL's website and download his reports on tin 
pest. Rockwell Collins also has published some investigation results which 
I'll send to you. The current industry "thoughts" on tin pest is that 
leadfree electronics are at low risk of the phenomena causing issues. 

Dave Hillman
Rockwell Collins
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Rex Waygood <[log in to unmask]> 
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12/22/2008 09:14 AM
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Subject
[TN] Tin Pest






Can someone tell me why I should not worry?
I am told that tin pest has not occurred in electronic circuits where
lead free (high tin) alloys have been used for years.
I have seen the NPL video where tin pest propagates rapidly from a
seeded tin bar into lead free alloys that were anticipated to be immune.
When I buy components now it is likely they have a matt tin plating.
(Probably not the case historically)
Is that plating likely to be a seed for a lead free solder joint? 
I have customers where the end product goes to some very cold places,
they are not RoHS exempt, so what do I advise them? 


Rex Waygood
Technical Manager
 
PartnerTech Poole Ltd 
Benson Road
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Dorset BH17 0RY
United Kingdom
 
Tel: +44 (0)1202 674333
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DDI: +44 (0)1202 338222
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