Can someone tell me why I should not worry?
I am told that tin pest has not occurred in electronic circuits where
lead free (high tin) alloys have been used for years.
I have seen the NPL video where tin pest propagates rapidly from a
seeded tin bar into lead free alloys that were anticipated to be immune.
When I buy components now it is likely they have a matt tin plating.
(Probably not the case historically)
Is that plating likely to be a seed for a lead free solder joint? 
I have customers where the end product goes to some very cold places,
they are not RoHS exempt, so what do I advise them? 


Rex Waygood
Technical Manager
 
PartnerTech Poole Ltd 
Benson Road
Poole
Dorset BH17 0RY
United Kingdom
 
Tel: +44 (0)1202 674333
Fax: +44 (0)1202 678028
DDI: +44 (0)1202 338222
Mob: +44 (0)7887 997403
 
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www.PartnerTech.co.uk

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