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December 2008

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Subject:
From:
Dave Connitt <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 2 Dec 2008 09:07:27 -0500
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Hello List,
We are considering implementing a 0.80 mm pitch BGA on a development
project and I have question about escape vias.
The part manufacturer recommends that we use a 0.019" pad with a 0.010"
drill. The board has to be a IPC-6012 class 3 PWB and I would like to
have a 0.003 annular ring on the escape vias. 
One of our board vendors suggested we use a epoxy filled via which would
relieve us of the annular ring issue but I am not sure about still being
a class 3 board. Does anybody know where I can confirm that epoxy filled
vias are acceptable in a class 3 board?
Thanks,
 
Dave Connitt CID+
Printed Circuit Designer
KDI Precision Products, Inc.
A Wholly Owned Subsidiary of:
L3 Communications
3975 McMann Road
Cincinnati, Ohio 45245
Ph. 513- 943-2010   Fax 513-943-2288

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