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December 2008

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Subject:
From:
"Terry L. Munson" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 17 Dec 2008 20:28:03 -0500
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Paul
I would agree with your comments and add the use of steam for localized or total board cleaning of difficult no clean residues.  We have an Aquastorm 200 with saponified low pressure wash and we follow the wash with an industrial steam rinse and are very effective at removing the flux residues and any board fab residues from below low standoff parts as well as out of via's.  If anyone would like to discuss this type of cleaning we have been doing for the last eight years give me a call or email.  I get the opportunity to work over the holiday break cleaning thousands of expensive low standoff no clean assemblies with this method.  




Terry Munson

Foresite. 


-----Original Message-----
From: Paul Edwards <[log in to unmask]>
To: [log in to unmask]
Sent: Wed, 17 Dec 2008 12:32 pm
Subject: Re: [TN] flux and board cleaning issues








Always did like trichlor...

We are currently using an EnviroSense's Enviro Gold #816 solution in a batch 
cleaner to remove most NC fluxes then send the PCA through a normal aqueous 
clean to remove all other residues...This works really well...

To make the NC flux easier to remove we normally put alcohol on soldering area 
before soldering with NC flux...

I agree with the water wash because it is an inexpensive solute and you actually 
are trying to remove the residues from the surface of the PCA not just moving 
them around on the surface...

The really interesting thing is that I have never seen any water o
r solvent 
washed commercial/industrial/consumer PCAs from Asia in at least 15 years...
Are there any manufacturing plants in Asia using full PCA cleaning as part of 
the standard assembly process?


Paul

Paul Edwards
Surface Art Engineering


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Phil Nutting
Sent: Wednesday, December 17, 2008 5:42 AM
To: [log in to unmask]
Subject: Re: [TN] flux and board cleaning issues

I've been experimenting with Kyzen Cybersolv(r) 141-R for removing flux residue.  
So far it works far better than alcohol and evaporates quickly.  Kind of like 
the old 1.1.1 trich I used in my formative years.

Yes, we've always used alcohol too, but it really does a lousy job of cleaning.  
It does a better job of diluting the flux and making sure it then covers 
everything.

My preferred choice is water soluble (OA) fluxes with a good DI water wash when 
the assembly methods allow.

Phil Nutting

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee Whiteman
Sent: Wednesday, December 17, 2008 8:15 AM
To: [log in to unmask]
Subject: Re: [TN] flux and board cleaning issues

Have you considered using some Microcare products? They may be more effective in 
removing flux via hand cleaning than IPA. Compressed air can be used, but it 
represents an ESD problem unless you are using a nozzle that is grounded.

It has been my experience that IPA would dilute the flux residues but not 
necessarily remove them. It also depends on the 
time between soldering and 
cleaning. The shorter the time, the easier it is to remove the flux.

Lee Whiteman, PMP
Senior Member Engineering Staff
L-3 Communications East
Telephone: (856) 338-3508
FAX: (856) 338-2906
E-Mail: [log in to unmask]

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wilson, Bob
Sent: Tuesday, December 16, 2008 7:12 PM
To: [log in to unmask]
Subject: Re: [TN] flux and board cleaning issues

Rosin Mildly Activated

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of R Sedlak
Sent: Tuesday, December 16, 2008 4:04 PM
To: [log in to unmask]
Subject: Re: [TN] flux and board cleaning issues

Bob:  Why not advise on the type of flux you are using.

Rudy Sedlak
RD Chemical Company

--- On Tue, 12/16/08, Wilson, Bob <[log in to unmask]> wrote:
From: Wilson, Bob <[log in to unmask]>
Subject: [TN] flux and board cleaning issues
To: [log in to unmask]
Date: Tuesday, December 16, 2008, 3:55 PM

Hi,

I have a lead who is an IPC J-STD-001 certified trainer and she is very
good.  We are using a board assembly that has a nut plate under a
high-density 26-pin DSUB.

The girls were soaking the assemblies in an alcohol bath and the lead
assembler said she didn't want the boards soaked in alcohol because it
isn't 100% guaranteed to remove all the flux from under the connector or
nut plate.

She has the girls trying to get a brush under there to get the flux out.

Am I nuts or have I been under the wrong impression that alcohol and
com
pressed air is the best way to clean a fluxed board?  I hate the idea
of me saying something like, "But...but that's the way we've
always done
it!"

(I don't have J-STD-001 here on the design side).

Thanks a bunch.

Bob Wilson

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