TECHNET Archives

December 2008

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Werner Engelmaier /* <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 1 Dec 2008 18:33:43 EST
Content-Type:
text/plain
Parts/Attachments:
text/plain (47 lines)
Hi,
I just received the 'Final Draft of the C-revision for PC-4101, Specification 
for Base Materials for Rigid and Multilayer Printed Boards.   
I am rather disappointed to find that the STII-concept has not been included 
in this draft. I was promised that the concept would get serious consideration 
and be included in the C-revision 'if appropriate'.
Over 2 years have passed since I withdrew my NEGATIVE on the B-revision of 
this document to expedite its timely publication, even though flawed. From what 
I can tell from the meeting minutes absolutely nothing has been done by the 
committee regardng the inclusion of the STII-concept into IPC-4101C.
The STII-concept has found favorable interest by users both in the USA and 
Europe, with some interest expressed in Asia as well. Its effectiveness is 
clearly evident, it does not take anything away from any of the materials, it makes 
selection for suitability much easier, and it combines the impact of the 
major parameters affecting PCB survival/reliability.
Given the impact of the high LF-soldering temperatures on the survivability 
and reliability of PCBs, and given the fact that more and more people are 
actually going LF-free, it is important that designers are given all appropriate 
and necessary tools. 
As this draft stands, I will vote NEGATIVE.
However, if I am a single voice in the wilderness, the committee might be 
tempted to again postpone addressing the issues. I therefore urge you send 
appropriately worded comments to the people below:
[log in to unmask]
[log in to unmask]
[log in to unmask]
[log in to unmask]

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2