To all on the forum, I would like to express my gratitude and sincere thanks for having the opportunity to learn, contribute, and collaborate with such fine people, all across the world.
 
Due to the current economic climate, I have joined the ranks of many other good individuals ... and have been down-sized....
 
While I search for another opportunity, I will 'lurk' more and likely contribute less, as my focus will be directed more inwards.
 
Once the winds calm and I can find a new landing spot, I will be back on board with the enthusiasm that is so widespread on this forum.
 
 
- - - - - - 
In the mean time, should anyone know of an need for a person that is highly skilled in Microelectronics [MCM's] materials, process, and packaging development - here I am !!!!    :-)
 
Currently in West Michigan, but considering options.  Please contact off-Net at [log in to unmask]
 
Thanks
 
Steve
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