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December 2008

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Thu, 11 Dec 2008 07:49:42 -0500
Content-Type:
text/plain
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text/plain (85 lines)
Transfer molding. 
--------------------------
Sent using BlackBerry


----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Thu Dec 11 05:41:52 2008
Subject: Re: [TN] POP underfill?

Could you use a no flow under-fill? 
This replaces flux in assembly cycle and cures during reflow so no
additional 'fill needs to be wicked in.

Regards 

Mike Fenner 
Indium Corporation 

 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Phillip Bavaro
Sent: Wednesday, December 10, 2008 7:04 PM
To: [log in to unmask]
Subject: [TN] POP underfill?

We normally underfill our BGAs by dispensing next to the device and 
allowing capillary forces pull the material under the BGA.

Now we have a Package on Package (POP) BGA assembly to build........is the 
upper memory BGA expected to be underfilled as well?

And if so, how is that accomplished?

This chip on top has the same dimensions as the BGA below so there is no 
shoulder to dispense upon.

Thanks in advance,

Phil

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