We normally underfill our BGAs by dispensing next to the device and 
allowing capillary forces pull the material under the BGA.

Now we have a Package on Package (POP) BGA assembly to build........is the 
upper memory BGA expected to be underfilled as well?

And if so, how is that accomplished?

This chip on top has the same dimensions as the BGA below so there is no 
shoulder to dispense upon.

Thanks in advance,

Phil

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