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December 2008

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From:
Rudolph yu <[log in to unmask]>
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TechNet E-Mail Forum <[log in to unmask]>, Rudolph yu <[log in to unmask]>
Date:
Mon, 22 Dec 2008 18:56:01 +0000
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Besides performing a destructive test, what other method can be used to detect microfacture on a solder joints?
According to our process engineer, the 5DX machine is not capble to catch an hairline open..., and we already use it to inspect for any manufactuing related defecs, but could not find any. 
 
 
 
 > Date: Mon, 22 Dec 2008 13:43:23 -0500> From: [log in to unmask]> Subject: Re: [TN] What could be the root cause for a failed board that passed functiona test after going through reflow for the 2nd time?> To: [log in to unmask]> > Hmmmm,> > Familiar Story:> > Board Works, Board Ships, Board Fails and is returned. Board works back at> factory. You simply added a reflow cycle to "Fix" the problem.> > Next time you need to find out WHY a bad bard is failing, making it "Work"> with magic or reflow does not allow you to resolve the real problem.> > Bob Kondner> > > > > > -----Original Message-----> From: TechNet [mailto:[log in to unmask]] On Behalf Of Rudolph yu> Sent: Monday, December 22, 2008 1:35 PM> To: [log in to unmask]> Subject: [TN] What could be the root cause for a failed board that passed> functiona test after going through reflow for the 2nd time?> > Hi:> > We have a proto assembly that passed the functional test initially. But> after we shipped it to the customer, it failed at the their site for the> same kind of test. After we received the board back, we reflowed it using> the same reflow profile, and the board would funcation once again... > We checked the boards under 5DX after we received it back from the customer> and found no defects on it.> > What could be causing this? and why the assembly would pass the test in the> first place? > > Here iare couple areas that I could think of...but not sure if they are> valid.> > 1. Certain parts (microBGA) may be better off to have underfill underneath> for thermal mismatch? ( Need to check spec)> 2. During handling and shipping, the board may be stressed to a degree that> a microfacture is formed.> > What other areas could cause this problem.> > Thanks> Rudolph > > > > > > _________________________________________________________________> Life on your PC is safer, easier, and more enjoyable with Windows VistaR. > http://clk.atdmt.com/MRT/go/127032870/direct/01/> ---------------------------------------------------> Technet Mail List provided as a service by IPC using LISTSERV 15.0> To unsubscribe, send a message to [log in to unmask] with following text in> the BODY (NOT the subject field): SIGNOFF Technet> To temporarily halt or (re-start) delivery of Technet send e-mail to> [log in to unmask]: SET Technet NOMAIL or (MAIL)> To receive ONE mailing per day of all the posts: send e-mail to> [log in to unmask]: SET Technet Digest> Search the archives of previous posts at: http://listserv.ipc.org/archives> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16> for additional information, or contact Keach Sasamori at [log in to unmask] or> 847-615-7100 ext.2815> -----------------------------------------------------> > ---------------------------------------------------> Technet Mail List provided as a service by IPC using LISTSERV 15.0> To unsubscribe, send a message to [log in to unmask] with following text in> the BODY (NOT the subject field): SIGNOFF Technet> To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)> To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest> Search the archives of previous posts at: http://listserv.ipc.org/archives> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815> -----------------------------------------------------
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