Ni hao,
Use SAC 305 or 405.
Regards,
Werner Engelmaier
可靠性先生
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelm
-----Original Message-----
From: [log in to unmask]
To: TechNet E-Mail Forum <[log in to unmask]>; Werner engelmaier <[log in to unmask]>
Cc: [log in to unmask]
Sent: Tue, 9 Dec 2008 4:18 am
Subject: Re: [TN] BGA soldering open issue
thanks! Werner
The ball material of the BGA is SAC-305.
Which should I choose to use as paste for high reliability
between SAC305,SAC405,SAC105,and leaded tin?
hechong
Werner engelmaier <[log in to unmask]>
发件人: TechNet <[log in to unmask]>
2008-12-09 07:28
请答复 给
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主题
Re: [TN] ??: Re: [TN] BGA soldering
open issue
Hi Victor,
Normally these pics open--now I am on the road and things get even more
difficult.
It is not the weight but the different thermal expansion of the various
BGA ayers.
=0
A
Werner
-----Original Message-----
From: [log in to unmask]
To: [log in to unmask]
Cc: [log in to unmask]
Sent: Sun, 7 Dec 2008 1:29 pm
Subject: RE: [TN] ??: Re: [TN] BGA soldering open issue
Werner,
?
?? I was unable to open the
file.? ?I can see the borders.? ?I too was not aware that
attached H/S could cause solder bump open issues. ??What is the least
recommended H/S weight that would not cause a BGA solder bump issues? ??Can
you share supporting data/documentation/case study?
?
Victor,
?
From:
[log in to unmask] [mailto:[log in to unmask]]
Sent: Friday, December 05, 2008
3:37 PM
To: Hernandez, Victor G; [log in to unmask]
Subject: Re: [TN] ??: Re: [TN] BGA
soldering open issue
?
Hi Victor,
Here it is:
Werner
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