Sun Microsystems has found the STII formula to be overly simplistic,
with great potential for false confidence. In-depth qualification runs
for evaluating lead-free assembly board processing are still required.
The addition of new test methods such as fracture toughness may
potentially mitigate this requirement.
Regards,
Karl Sauter
Stadem, Richard D. wrote, On 12/04/08 05:34:
> I couldn't agree more. I don't understand why the STII formula would
> not be added with alacrity and dispatch.
>
> -----Original Message-----
> From: Leadfree [mailto:[log in to unmask]] On Behalf Of Fox, Ian
> Sent: Thursday, December 04, 2008 2:59 AM
> To: [log in to unmask]
> Subject: Re: [LF] Fwd: Draft for IPC-4101C
>
> Werner, I like the STII concept and in my opinion not only should it be
> in 4101 it should also be included in the materials section of 2221.
>
> Regards
> Ian Fox
> Goodrich ECS
>
> -----Original Message-----
> From: Leadfree [mailto:[log in to unmask]] On Behalf Of Werner engelmaier
> Sent: 03 December 2008 23:11
> To: [log in to unmask]
> Subject: [LF] Fwd: Draft for IPC-4101C
>
>
> Guys & Gals,
> Doug Sober wrote:
>
> "I admit that we promised you consideration for the C Revision.? We do
> need some testimonials for people that feel that it has value.
>
>
>
>
>
> For sure your recipe makes sense and it does provide a guide to
> lead-free assembly compatibility, however the materials picked by this
> method are normally the higher Tg, higher priced and more specialized
> FR-4.?
>
>
>
>
>
> Customers cannot always purchase
> specification sheet 126 materials.
>
>
>
>
>
> But I would be willing to listen to the
> testimonials. ?It is not going to happen for this revision however.
>
>
>
>
>
> Doug"
>
> Keep those 'testimonials' coming. I guess we do technology by democratic
> principles.
>
> Of course, you do not need /126 for most applications. My take on the 12
> keyworded:
> "Lead-free-FR-4" slash-sheet material groups in the C-rev is as follows:
>
>
> For Rev. C (Final Draft) /126, /129, /130 and /131 are fully compatible
> with
> /126 and /130 being the best choices because of their lower CTE(z), and
> /99, /124, /125 and /128 limited; the others [/101, /121, /122, /127]
> keyworded:
> "Lead-free-FR-4' may be problematic with LF-soldering temperatures.
>
>
> Just for reference, for Rev. B, /126 and /129 are fully compatible, /99
> and
> /124 to a more limited extent.
>
> You should have an easily-applied tool to pre-select materials likely
> meeting your needs.
>
>
>
>
> Regards,
>
> Werner Engelmaier
>
> Engelmaier Associates, L.C.
>
> Electronic Packaging, Interconnection and Reliability Consulting
>
> 7 Jasmine Run
>
> Ormond Beach, FL 32174 USA
>
> Phone: 386-437-8747, Cell: 386-316-5904
>
> E-mail: [log in to unmask], Website: www.engelmaier.com
>
>
>
>
> -----Original Message-----
> From: Sober, Doug <[log in to unmask]>
> To: [log in to unmask]; [log in to unmask]
> Cc: [log in to unmask]; tony senese <[log in to unmask]>
> Sent: Wed, 3 Dec 2008 4:14 pm
> Subject: RE: Draft for IPC-4101C
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
> Werner,
>
>
>
> ?
>
>
>
> I admit that we promised you consideration for the C Revision.? We do
> need some testimonials for people that feel that it has value.
>
>
>
> ?
>
>
>
> For sure your recipe makes sense and it does provide a guide to
> lead-free assembly compatibility, however the materials picked by this
> method are normally the higher Tg, higher priced and more specialized
> FR-4.?
>
>
>
> ?
>
>
>
> Customers cannot always purchase
> specification sheet 126 materials.
>
>
>
> ?
>
>
>
> But I would be willing to listen to the
> testimonials. ?It is not going to happen for this revision however.
>
>
>
> ?
>
>
>
> Doug
>
>
>
> ?
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
> From:
> [log in to unmask] [mailto:[log in to unmask]]
>
> Sent: Monday, December 01, 2008
> 5:32 PM
>
> To: [log in to unmask]
>
> Cc: Sober, Doug; [log in to unmask];
> [log in to unmask]
>
> Subject: Re: Draft for IPC-4101C
>
>
>
>
>
>
> ?
>
>
>
> Hi Tom,
>
> I am rather disappointed to find that the STII-concept has not been
> included in this draft. I was promised that the concept would get
> serious consideration and be included in the C-revision 'if
> appropriate'.
>
> Over 2 years have passed since I withdrew my NEGATIVE on the B-revision,
> and from what I can tell from the meeting minutes absolutely nothing has
> been done by the committee in this regard.
>
> The STII-concept has found favorable interest by users both in the USA
> and Europe, with some interest expressed in Asia as well. Its
> effectiveness is clearly evident, it does not take anything away from
> any of the materials, it makes selection for suitability much easier,
> and it combines the impact of the major parameters affecting PCB
> survival/reliability.
>
> So, clearly, the STII-concept is appropriate.
>
> As this draft stands, it will receive a NEGATIVE from me.
>
>
>
> Regards,
>
> Werner Engelmaier
>
> Engelmaier Associates, L.C.
>
> Electronic Packaging, Interconnection and Reliability Consulting
>
> 7 Jasmine Run
>
> Ormond Beach, FL 32174 USA
>
> Phone: 386-437-8747, Cell: 386-316-5904
>
> E-mail: [log in to unmask], Website: www.engelmaier.com
>
>
>
>
>
>
>
>
>
>
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>
--
Karl Sauter
Principal Engineer, PCB Technology
Sun Microsystems, Inc.
4120 Network Circle (Bldg. 12)
Santa Clara, CA 95054
Phone: (408) 276-3207
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