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December 2008

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Thu, 4 Dec 2008 07:34:28 -0600
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 I couldn't agree more. I don't understand why the STII formula would
not be added with alacrity and dispatch.

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Fox, Ian
Sent: Thursday, December 04, 2008 2:59 AM
To: [log in to unmask]
Subject: Re: [LF] Fwd: Draft for IPC-4101C

Werner, I like the STII concept and in my opinion not only should it be
in 4101 it should also be included in the materials section of 2221.

Regards
Ian Fox
Goodrich ECS

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Werner engelmaier
Sent: 03 December 2008 23:11
To: [log in to unmask]
Subject: [LF] Fwd: Draft for IPC-4101C


 Guys & Gals,
Doug Sober wrote:

"I admit that we promised you consideration for the C Revision.? We do
need some testimonials for people that feel that it has value.





For sure your recipe makes sense and it does provide a guide to
lead-free assembly compatibility, however the materials picked by this
method are normally the higher Tg, higher priced and more specialized
FR-4.? 





Customers cannot always purchase
specification sheet 126 materials.





But I would be willing to listen to the
testimonials. ?It is not going to happen for this revision however.





Doug"

Keep those 'testimonials' coming. I guess we do technology by democratic
principles.

Of course, you do not need /126 for most applications. My take on the 12
keyworded:
"Lead-free-FR-4" slash-sheet material groups in the C-rev is as follows:


For Rev. C (Final Draft) /126, /129, /130 and /131 are fully compatible
with
/126 and /130 being the best choices because of their lower CTE(z), and
/99, /124, /125 and /128 limited; the others [/101, /121, /122, /127]
keyworded:
"Lead-free-FR-4' may be problematic with LF-soldering temperatures. 


Just for reference, for Rev. B, /126 and /129 are fully compatible, /99
and
/124 to a more limited extent. 

You should have an easily-applied tool to pre-select materials likely
meeting your needs.


 

Regards,

Werner Engelmaier

Engelmaier Associates, L.C.

Electronic Packaging, Interconnection and Reliability Consulting

7 Jasmine Run

Ormond Beach, FL 32174 USA

Phone: 386-437-8747, Cell: 386-316-5904

E-mail: [log in to unmask], Website: www.engelmaier.com


 

-----Original Message-----
From: Sober, Doug <[log in to unmask]>
To: [log in to unmask]; [log in to unmask]
Cc: [log in to unmask]; tony senese <[log in to unmask]>
Sent: Wed, 3 Dec 2008 4:14 pm
Subject: RE: Draft for IPC-4101C
































Werner,



?



I admit that we promised you consideration for the C Revision.? We do
need some testimonials for people that feel that it has value.



?



For sure your recipe makes sense and it does provide a guide to
lead-free assembly compatibility, however the materials picked by this
method are normally the higher Tg, higher priced and more specialized
FR-4.? 



?



Customers cannot always purchase
specification sheet 126 materials.



?



But I would be willing to listen to the
testimonials. ?It is not going to happen for this revision however.



?



Doug



?
















From:
[log in to unmask] [mailto:[log in to unmask]] 

Sent: Monday, December 01, 2008
5:32 PM

To: [log in to unmask]

Cc: Sober, Doug; [log in to unmask];
[log in to unmask]

Subject: Re: Draft for IPC-4101C






?



Hi Tom,

I am rather disappointed to find that the STII-concept has not been
included in this draft. I was promised that the concept would get
serious consideration and be included in the C-revision 'if
appropriate'.

Over 2 years have passed since I withdrew my NEGATIVE on the B-revision,
and from what I can tell from the meeting minutes absolutely nothing has
been done by the committee in this regard.

The STII-concept has found favorable interest by users both in the USA
and Europe, with some interest expressed in Asia as well. Its
effectiveness is clearly evident, it does not take anything away from
any of the materials, it makes selection for suitability much easier,
and it combines the impact of the major parameters affecting PCB
survival/reliability.

So, clearly, the STII-concept is appropriate.

As this draft stands, it will receive a NEGATIVE from me.



Regards,

Werner Engelmaier

Engelmaier Associates, L.C.

Electronic Packaging, Interconnection and Reliability Consulting

7 Jasmine Run

Ormond Beach, FL 32174 USA

Phone: 386-437-8747, Cell: 386-316-5904

E-mail: [log in to unmask], Website: www.engelmaier.com










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