Everyone tells me IPA is a poor solvent for modern flux residues, particularly
no-cleans. We do still use it but only locally for rework/touch-up however.
No-clean does not mean no residue, it just means what is left is safe to leave
where it is after soldering is complete. Unless the cleaning solvent and process
is matched to the residues, you run the risk of making "unsafe" the "safe"
residues located "safely" on your assembly. Freeing up the reside with IPA and
then moving it into every available nook and cranny with compressed air seems
unwise to me
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