Why your sip need exception? Your sip is not consists of ic s?  Are they made of polymer device?  What is intended work temp extreme and for how long? What is the environment of the sip would be in? Who you are going to sell it to?  If the sip is used in an environmental protected box with air temp control, rh and pressure and cleanliness all take care of, sure! 

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----- Original Message -----

From: TechNet <[log in to unmask]>

To: [log in to unmask] <[log in to unmask]>

Sent: Sat Nov 01 01:32:31 2008

Subject: [TN] IS there any Industry spec for SIP ( system in package ) reliability test?



Are there any industry spec, standards, or articles for system-in-package device in terms  of the reliability test requirement?

 

I was told to look at JESD 47, but isn't that written for device with level 1 attachment? (Chip that has die and wire bonding inside the encapsulation)

 

If I subject the SIP device to the JESD47 test parameters, I am afraid the samples will not survive the conditions tailored for the IC package.

 

And if I have to stick with JESD47, do I have the flexibility for temperature settings and  test cycles?

 

 

Thanks 

Rudolph 

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