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November 2008

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Tue, 11 Nov 2008 11:12:59 -0600
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text/plain (115 lines)
Inge, I found this very interesting. Thanks. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Tuesday, November 11, 2008 10:47 AM
To: [log in to unmask]
Subject: Re: [TN] Effect of Soldering in a Ni atmosphere on BGA
reliabilty

My contribution is not an exact answer on your question, but may be of
interest for some people.  There are many ways to minimize the amount of
flux and control the atmosphere in which the soldering take parts. One
way that we have introduced recently is to use 'vacuum' VP. Sounds
strange, and it is. This machine pumps out the air in the soldering
chamber during the top temperature stage. So, the solder will wet better
into voids and surface, while at the same time the oxygen level is
decreased. It's not a real vacuum of course, but enough lowered air
pressure to have a clear positive impact on the solder joint quality and
also result in less flux residues. If you are interested, you can read
about it below.

http://www.ibl-loettechnik.de/downloads/Aktuelles/Todays%20Vapor%20Phase
%20Soldering%20SMTAI%20Orlando%20-%20080820.pdf

Inge


----- Original Message -----
From: "Eric CHRISTISON" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, November 10, 2008 1:47 AM
Subject: [TN] Effect of Soldering in a Ni atmosphere on BGA reliabilty


>A customer has experienced solder joint failures in a lead free BGA
device 
>which are unexpected for us.
>
> The test the solder joints failed was a shock test in the plane of the
PWB 
> and the joints failed at the interface between the SJ and our BGA
device 
> substrate.
>
> We've done similar tests without failure but when we did our trials we

> soldered the devices onto the boards in a hot air oven. Our customer
used 
> a nitrogen oven. Could this affect SJ strength in any way?
>
> Just wondering whether this is worth investigating.
>
> Regards,
>
>
> -- 
> Eric Christison Msc
> Mechanical Engineer
> Consumer & Micro group
> Imaging Division
>
> STMicroelectronics (R&D) Ltd
> 33 Pinkhill
> Edinburgh EH12 7BF
> United Kingdom
>
> Tel: +44 (0)131 336 6165
> Fax: + 44 (0)131 336 6001
>
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