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| Date: | Mon, 10 Nov 2008 09:54:01 -0800 |
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Eric,
My guess is that you are using a Au,Ni surface finish on your BGA substrate and that is causing the problem...
Oh.. just to be a pain... symbol for Nitrogen typically used is N2..
Ni is Nickel...
Paul
Paul Edwards
Surface Art Engineering
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Eric CHRISTISON
Sent: Monday, November 10, 2008 1:47 AM
To: [log in to unmask]
Subject: [TN] Effect of Soldering in a Ni atmosphere on BGA reliabilty
A customer has experienced solder joint failures in a lead free BGA
device which are unexpected for us.
The test the solder joints failed was a shock test in the plane of the
PWB and the joints failed at the interface between the SJ and our BGA
device substrate.
We've done similar tests without failure but when we did our trials we
soldered the devices onto the boards in a hot air oven. Our customer
used a nitrogen oven. Could this affect SJ strength in any way?
Just wondering whether this is worth investigating.
Regards,
--
Eric Christison Msc
Mechanical Engineer
Consumer & Micro group
Imaging Division
STMicroelectronics (R&D) Ltd
33 Pinkhill
Edinburgh EH12 7BF
United Kingdom
Tel: +44 (0)131 336 6165
Fax: + 44 (0)131 336 6001
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