A customer has experienced solder joint failures in a lead free BGA 
device which are unexpected for us.

The test the solder joints failed was a shock test in the plane of the 
PWB and the joints failed at the interface between the SJ and our BGA 
device substrate.

We've done similar tests without failure but when we did our trials we 
soldered the devices onto the boards in a hot air oven. Our customer 
used a nitrogen oven. Could this affect SJ strength in any way?

Just wondering whether this is worth investigating.

Regards,


-- 
Eric Christison Msc
Mechanical Engineer
Consumer & Micro group
Imaging Division

STMicroelectronics (R&D) Ltd
33 Pinkhill
Edinburgh EH12 7BF
United Kingdom

Tel:	+44 (0)131 336 6165
Fax:	+ 44 (0)131 336 6001

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