Are there any industry spec, standards, or articles for system-in-package device in terms  of the reliability test requirement?
 
I was told to look at JESD 47, but isn't that written for device with level 1 attachment? (Chip that has die and wire bonding inside the encapsulation)
 
If I subject the SIP device to the JESD47 test parameters, I am afraid the samples will not survive the conditions tailored for the IC package.
 
And if I have to stick with JESD47, do I have the flexibility for temperature settings and  test cycles?
 
 
Thanks 
Rudolph 
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