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November 2008

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From:
Grunde Gjertsen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 7 Nov 2008 10:26:11 +0100
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Wetting and intermetallic strength. My impression is that Palladium needs 
an elevated temperature to solder well as it works fine at leadfree 
temperatures but not SnPb.
This was also a big issue with Pd plated passives some years ago but I 
don't know if it's directly comparable.

Best regards
Grunde







Bob METCALF <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
06.11.2008 03:04
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Subject
Re: [TN] Build backplane with lead free HASL surface finish?






What sort of trouble?

Regards,

Bob Metcalf
Atotech Western Regional Manager

Cell 714-334-7667
E-Mail [log in to unmask] 

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Grunde Gjertsen <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
11/05/2008 05:48 PM
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Re: [TN] Build backplane with lead free HASL surface finish?






You may get into trouble with ENIPIG.

Grunde






Robin John <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
04.11.2008 21:02
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Re: [TN] Build backplane with lead free HASL surface finish?






Dear Experts,
What are the different RoHS component lead finishes? Will any RoHS
component lead finishes have solderability issues if used with a leaded
paste?
Thanks in advance.
Robin John
TouchSensor Technologies
e-mail: [log in to unmask]
 
 

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