You can send your pictures to me, and I will post them on our
"Technetter" web page and then provide a link...
Steve
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Woolley, Mark D.
(Mark)
Sent: Thursday, November 06, 2008 10:15 AM
To: [log in to unmask]
Subject: Re: [TN] AL CU DENDRTIES INSIDE PLASTIC IC
Please note the TechNet services strips off pictures. I forget who has
the ability to post them and place a link in the email. Perhaps someone
else remembers.
mark
Mark Woolley
PTRL Laboratory
Avaya, 1300 West 120th Ave, Area 33, Westminster, CO, 80234
Voice/FAX: 303-538-9179
Lab (Voice Only): 303-538-2166
Do it Only Once
Make it Correct the First Time
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Roberts, Jon
Sent: Thursday, November 06, 2008 8:39 AM
To: [log in to unmask]
Subject: Re: [TN] AL CU DENDRTIES INSIDE PLASTIC IC
Enclosed is picture of the dendrites.
I indicated Al but here is what the report stated:
EDX Spectra #1 is from the thick part of the dendrite on the bond pad
area, and shows a strong peak of silver (Ag) along with smaller peaks of
gold (Au), copper (Cu). EDX Spectra #2 is the dendrite growth on the
Si surface; here the stronger peak is Ag with a trace of Cu. The wire
ball is seen in EDX Spectra #3 and is primarily Au with smaller traces
of Ag.
Thanks for any inputs to help understand moisture penetrating the
plastic body (through plastic or the area around where the leads
enter/exit the body.
Sincerely Jon
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Thursday, November 06, 2008 7:27 AM
To: [log in to unmask]
Subject: Re: [TN] AL CU DENDRTIES INSIDE PLASTIC IC
The resistivity of the IMC plus voids might got something to do with the
failure.
--------------------------
Sent using BlackBerry
----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Thu Nov 06 03:23:52 2008
Subject: Re: [TN] AL CU DENDRTIES INSIDE PLASTIC IC
Apparently, the Obama fever has not stopped TN conversation. Too many
old foxes, do not bother I guess.
As to the topic, not our experience. We ran aging tests in elevated
temperature on some packages, no bias, and nothing happened. Then we did
same with very high current through the bond wires, and got horrible
growths of Au/Al IMC products around the bond site. Finally, the bond
wires lifted. We draw the conclusion, that the high current caused a
temperature rise in the bondwire itself, thus adding some thermodynamic
activity.
/Inge
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Woolley, Mark D.
(Mark)
Sent: den 6 november 2008 00:09
To: [log in to unmask]
Subject: Re: [TN] AL CU DENDRTIES INSIDE PLASTIC IC
Purple plague is an intermetallic alloy that is formed at the junction
of the Aluminum pad where the Gold bondwire is bonded. But this is not
a dendrite. It is a multi-crystalline growth that appears as a dark or
purple ring around the ball of the gold bondwire. Typically dendrites,
which will grow within a contaminated plastic IC, do not contain gold.
All it takes is the aluminum, moisture, and an electric field.
In the past purple plague has been generally caused by high temperature
whether or not the IC is powered. It usually causes an open circuit
(eventually) due to Kirkendahl voiding at the interface. With today's
very closely pitched bonding pads the purple plague growth may be able
to bridge between two adjacent bonding pads.
But again, this is not a dendrite. Dendrites need an electric field to
induce growth, purple plague occurs in the absence of an electric field.
It occurs at some rate continuously, but at normal operating
temperatures grows so slowly that it is not considered a primary factor
in calculating the lifetime of an IC.
mark
Mark Woolley
PTRL Laboratory
Avaya, 1300 West 120th Ave, Area 33, Westminster, CO, 80234
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Roberts, Jon
Sent: Tuesday, November 04, 2008 3:39 PM
To: [log in to unmask]
Subject: [TN] AL CU DENDRTIES INSIDE PLASTIC IC
Has anyone have knowledge or experience with AL Cu Dendrites growth in
plastic IC components? Reports or other information is appreciated,
Thanks, Jon
This communication is intended only for use by the addressee(s) named
herein and may contain business confidential and/or legally privileged
information. If you are not the intended recipient of this e-mail, you
are hereby notified that any dissemination, distribution, disclosure or
copying of this e-mail and its contents is strictly prohibited. If you
have received this e-mail in error, kindly notify the sender by replying
to this message. In addition, please permanently delete the message and
any attachments without copying or disclosing the contents. Thank you
for your cooperation.
THIS DOCUMENT AND/OR SHIPMENT MAY CONTAIN COMMODITY ITEMS, SOFTWARE OR
TECHNICAL DATA THAT IS CONTROLLED BY U.S. EXPORT LAW, AND MAY NOT BE
EXPORTED OUTSIDE THE UNITED STATES OR TO NON U.S. PERSONS WITHOUT THE
APPROPRIATE EXPORT LICENSE FROM EITHER THE U.S. DEPARTMENT OF STATE OR
DEPARTMENT OF COMMERCE.
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0 To
unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing
per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0 To
unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to [log in to unmask]: SET
Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the
posts: send e-mail to [log in to unmask]: SET Technet Digest Search the
archives of previous posts at: http://listserv.ipc.org/archives Please
visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------
---------------------------------------------------------------------
This transmission (including any attachments) may contain confidential
information, privileged material (including material protected by the
solicitor-client or other applicable privileges), or constitute
non-public information. Any use of this information by anyone other than
the intended recipient is prohibited. If you have received this
transmission in error, please immediately reply to the sender and delete
this information from your system. Use, dissemination, distribution, or
reproduction of this transmission by unintended recipients is not
authorized and may be unlawful.
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------
This communication is intended only for use by the addressee(s) named
herein and may contain business confidential and/or legally privileged
information. If you are not the intended recipient of this e-mail, you
are hereby notified that any dissemination, distribution, disclosure or
copying of this e-mail and its contents is strictly prohibited. If you
have received this e-mail in error, kindly notify the sender by replying
to this message. In addition, please permanently delete the message and
any attachments without copying or disclosing the contents. Thank you
for your cooperation.
THIS DOCUMENT AND/OR SHIPMENT MAY CONTAIN COMMODITY ITEMS, SOFTWARE OR
TECHNICAL DATA THAT IS CONTROLLED BY U.S. EXPORT LAW, AND MAY NOT BE
EXPORTED OUTSIDE THE UNITED STATES OR TO NON U.S. PERSONS WITHOUT THE
APPROPRIATE EXPORT LICENSE FROM EITHER THE U.S. DEPARTMENT OF STATE OR
DEPARTMENT OF COMMERCE.
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0 To
unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing
per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0 To
unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to [log in to unmask]: SET
Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the
posts: send e-mail to [log in to unmask]: SET Technet Digest Search the
archives of previous posts at: http://listserv.ipc.org/archives Please
visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
