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November 2008

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Subject:
From:
Joe Fjelstad <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 5 Nov 2008 18:37:35 EST
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Good description Mark
 
If I recall properly, having available excess of both metals on the two  
sides is important as well  for purple plague to occur. (e.g. Al  wire on thick 
gold pads or Au wire on thick Al pads)  The problem was  manifest in some early 
Al wire bonding when relatively thick gold wire bond  pads, common for gold 
wire thermocompression and  thermosonic bonding were used "as is" for Al wedge 
bonding. Gold  bonding on thin Al pads is very common these days.
 
Joe  
 
 
In a message dated 11/5/2008 3:09:33 P.M. Pacific Standard Time,  
[log in to unmask] writes:

Purple  plague is an intermetallic alloy that is formed at the junction
of the  Aluminum pad where the Gold bondwire is bonded.  But this is not
a  dendrite.  It is a multi-crystalline growth that appears as a dark  or
purple ring around the ball of the gold bondwire.  Typically  dendrites,
which will grow within a contaminated plastic IC, do not contain  gold.
All it takes is the aluminum, moisture, and an electric  field.

In the past purple plague has been generally caused by high  temperature
whether or not the IC is powered.  It usually causes an  open circuit
(eventually) due to Kirkendahl voiding at the interface.   With today's
very closely pitched bonding pads the purple plague growth may  be able
to bridge between two adjacent bonding pads. 

But again,  this is not a dendrite.  Dendrites need an electric field to
induce  growth, purple plague occurs in the absence of an electric field.
It occurs  at some rate continuously, but at normal operating
temperatures grows so  slowly that it is not considered a primary factor
in calculating the  lifetime of an IC. 

mark

Mark Woolley
PTRL  Laboratory
Avaya,  1300 West 120th Ave,   Area 33,   Westminster, CO, 80234

-----Original Message-----
From: TechNet  [mailto:[log in to unmask]] On Behalf Of Roberts, Jon
Sent: Tuesday, November  04, 2008 3:39 PM
To: [log in to unmask]
Subject: [TN] AL CU DENDRTIES  INSIDE PLASTIC IC

Has anyone have knowledge or experience with AL Cu  Dendrites growth in
plastic IC components?  Reports or other  information is appreciated,
Thanks, Jon  


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