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Subject:
From:
"Kane, Amol (349)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Kane, Amol (349)
Date:
Tue, 25 Nov 2008 09:19:14 -0500
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Thanks Richard! Interesting article indeed.

Regards,

Amol S. Kane
Process Engineer
Harvard Custom Manufacturing
PCBA Division
AS9100B and ISO9001:2000 Certified
[log in to unmask]
Web:  www.harvardgrp.com
Phone: 607-687-7669  Ext. 349
Fax:  607-687-9733

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Monday, November 24, 2008 11:15 AM
To: [log in to unmask]
Subject: Re: [TN] BGA Re-balling services

Richard, I would be interested in the patent publication number of the
oxygen evacuation process.

With so much inert gas use in the industry both for general soldering as
well as re-work - Nitrogen for reflow, flourinert for vapor phase and argon
for some processes both blanket and "stream" I would be very interested to
see how you did that!!

By the way, the article does not mention one of the major advantages of a
laser solder joint. The joints cool down from the inside out; as the fastest
heat transfer on cool down is by conduction into the substrate whereas a
conventional solder joint cools from the outside in as it is cooling by
convection - the whole assembly being at or near the same temperature which
is not the case with a laser.

This means that in general a laser soldered joint of this type as well as
having initially finer grain structure due to the faster cool down produced
by this method is less prone to any internal voiding issues due to the
cooling process.

John

John Burke
(408) 515 4992

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Monday, November 24, 2008 5:40 AM
To: [log in to unmask]
Subject: Re: [TN] BGA Re-balling services

Amol,
I recently developed a "superior" reballing method with a client I work
for called Analog Technologies, Inc. I am forwarding your email to them,
but in the meantime you can read about it in October's Circuits Assembly
magazine. Here is a link to the article, which was the cover story. This
is the best method to use, as it does not heat the component during the
stripping of the old solder or during the ball attachment process, thus
eliminating two thermal cycles. Solder spheres soldered with laser have
proven to be much more reliable than those soldered with convection,
especially when our patented oxygen evacuation is performed as part of
the laser reball process.
http://circuitsassembly.com/cms/content/view/7205/128/


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kane, Amol (349)
Sent: Friday, November 21, 2008 2:22 PM
To: [log in to unmask]
Subject: Re: [TN] BGA Re-balling services

Thanks for your replies! I am located in Upstate NY

--Amol


From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Friday, November 21, 2008 12:39 PM
To: Kane, Amol (349)
Subject: Re: [TN] BGA Re-balling services


Hi Amol - I recommend 4 services: Tintronics in Huntsville Alabama, Six
Sigma in San Jose CA, Premier in AZ and Corfin (a facility on the East
coast). All four do a good job (they do have their moments, they are
human) and are reasonable in cost/schedule.  I also recommend you review
their procedures/processes to make sure you approve their protocols.
Good Luck.

Dave

"Kane, Amol (349)" <[log in to unmask]> Sent by: TechNet
<[log in to unmask]>

11/21/2008 10:06 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to "Kane, Amol
(349)" <[log in to unmask]>


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Subject

[TN] BGA Re-balling services







Dear Technetters,
Looking for a reliable BGA-reballing service provider. Any
recommendations?

Thanks,
Amol






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WARNING:  Export Control
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WARNING:  Export Control 
This document may contain technical data within the definition of the 
International Traffic in Arms Regulations (ITAR), and subject to the Export 
Control Laws of the U.S. Government.  Transfer of such data by any means to a 
foreign person, whether in the United States or abroad, without proper export 
authorization or other approval from the U.S. Department of State is 
prohibited. 
 
CONFIDENTIALITY NOTICE: 
This e-mail, and any attachments, is for the sole use of the intended 
recipient(s) and may contain information that is confidential and 
protected from disclosure under the law. Any unauthorized review, use, 
disclosure, or distribution is prohibited. If you are not the intended 
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all copies of the original message and attachments. 
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