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Subject:
From:
Luan Nguyen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Luan Nguyen <[log in to unmask]>
Date:
Tue, 25 Nov 2008 14:32:45 +0700
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Dear Jack,
Thanks to your reply, we now understand more about criteria.
By the way, we also have some small queries that are:

# As your comment of item (1) "The beginning of Section 8 has criteria for bonding SMT parts", we reviewed item 8.1 and we think that this page is mentioned to staking adhesive on SMT part before they were soldered (we were having problem for bonding after soldering).

## What do you think about bonding on component for 1 side and 2 sides? Which is better?

### As item 7.3.2 "... bonding do not contact an unsleeved area of a sleeved glass body component". This is applied on PTH part. So, if we apply bonding on SMT PARTS that contact an unsleeved area of a sleeved glass body component, what do you think about this? IS the effect on glass SMT part same as on glass PTH part?

Hopefully you can help us.
Thank you in advance.

***************************
Nguyen Hoang Luan
QC&Training Supervisor
Spartronics VietNam Co, Ltd.
No.3, Street No.6, VSIP
Th An Dist., BDuong Prov., VN
Tel: (84-650) 784 890
Fax: (84-650) 784 891
Mobile: 090.3.667448
Email: [log in to unmask]
***************************

>>> Jack Crawford <[log in to unmask]> 20-Nov-08 17:53 >>>
Luan, I have answered your questions below, marked with >>>

Cordially
Jack

Jack Crawford, IOM
IPC Director Certification and Assembly Technology
[log in to unmask] 
847-597-2893
FAX  847-615-5693
3000 Lakeside Drive, Suite 309 S
Bannockburn, IL, 60015

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Luan Nguyen
Sent: Thursday, November 20, 2008 2:30 AM
To: [log in to unmask] 
Subject: [TN] Bonding criteria of IPC & J-STD

Dear Technet,
Our company were confused for Bonding criteria of IPC-A-610D & J-STD-001DS, are:

## IPC-A-610D
(1) For item 7.3.2, at top page "These criteria do not apply to SMT components"

Currently, our products had many SMT components which were required bonding but we don't know how to accept for applying and inspecting. And have any criteria mention to bonding for SMT part?
Please kindly advise us.

>>>>>Section 7 only has criteria for THROUGH-HOLE components. The beginning of Section 8 has criteria for bonding SMT parts. This statement is Section 7 is just telling people not to use through-hole criteria for SMT bonding.

(2) The first clause of acceptance "On a horizontally mounted component the adhesive adheres to component for at least 50% of its length (L), and 25% of its diameter (D), ON ONE SIDE..."

We think we were confused for "ON ONE SIDE". On 1 component, will be bond ONE side or TWO side to meet this clause?
Please help us to understand obviously.

>>>>>This is only for THROUGH-HOLE component. Your picture on the link below shows SMT components so this is not applicable. However, if you need to bond through-hole components, the adhesive has to be to 25% of the diameter on at least one side. It would be acceptable to be on two sides but two sides are not required.

Please see our sample as  link http://picasaweb.google.com/johnynhluan/SMT_BondingConfusing#5270655325850645730 

## J-STD-001DS
Item#10-d, "When coating, encapsulation, or staking materials are applied to through-hole glass, ceramic body, or hermetic components, the components SHALL be protected to prevent cracking,..."

We were confused this clause with 2 cases:
(1) Case #1: "... applied to
          + THROUGH-HOLE Glass components
          + THROUGH-HOLE Ceramic body components
          + Or THROUGH-HOLE hermetic components

(2) Case #2: " ... applied to
          + THROUGH-HOLE glass components
          + Ceramic body components
          + Or hermetic components
Please help us to understand obviously.

>>>>>Case #1 is the correct understanding.

Thank you very much.

***************************
Nguyen Hoang Luan
QC&Training Supervisor
Spartronics VietNam Co, Ltd.
No.3, Street No.6, VSIP
Th An Dist., BDuong Prov., VN
Tel: (84-650) 784 890
Fax: (84-650) 784 891
Mobile: 090.3.667448
Email: [log in to unmask] 
***************************

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