Amol,
I recently developed a "superior" reballing method with a client I work
for called Analog Technologies, Inc. I am forwarding your email to them,
but in the meantime you can read about it in October's Circuits Assembly
magazine. Here is a link to the article, which was the cover story. This
is the best method to use, as it does not heat the component during the
stripping of the old solder or during the ball attachment process, thus
eliminating two thermal cycles. Solder spheres soldered with laser have
proven to be much more reliable than those soldered with convection,
especially when our patented oxygen evacuation is performed as part of
the laser reball process.
http://circuitsassembly.com/cms/content/view/7205/128/
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kane, Amol (349)
Sent: Friday, November 21, 2008 2:22 PM
To: [log in to unmask]
Subject: Re: [TN] BGA Re-balling services
Thanks for your replies! I am located in Upstate NY
--Amol
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Friday, November 21, 2008 12:39 PM
To: Kane, Amol (349)
Subject: Re: [TN] BGA Re-balling services
Hi Amol - I recommend 4 services: Tintronics in Huntsville Alabama, Six
Sigma in San Jose CA, Premier in AZ and Corfin (a facility on the East
coast). All four do a good job (they do have their moments, they are
human) and are reasonable in cost/schedule. I also recommend you review
their procedures/processes to make sure you approve their protocols.
Good Luck.
Dave
"Kane, Amol (349)" <[log in to unmask]> Sent by: TechNet
<[log in to unmask]>
11/21/2008 10:06 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to "Kane, Amol
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Subject
[TN] BGA Re-balling services
Dear Technetters,
Looking for a reliable BGA-reballing service provider. Any
recommendations?
Thanks,
Amol
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