I guess it depends on the assembly...I've seen a customer change from
ENIG to OSP and found better results. It was a small thin board with
not many components. It was a high runner but required minimal rework.
When they were using ENIG there was a problem with the vendor
controlling the gold thickness from lot to lot, causing excess gold on
some lots, and thus Au-embrittlement.
Andy
Quoting stephengregory5849 <[log in to unmask]>:
> I've only used OSP one time, RAM SIMM modules. No wave solder, single
> sided reflow, and that was it. Worked fine for that...
>
> ----- Original Message ----- From: "Joyce Koo" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Sunday, November 23, 2008 9:11 PM
> Subject: Re: [TN] black pad,Enigversus OSP
>
>
> Agree! There is no fix, even with excellent process contol for bad
> design! If your design require 2 rework , I.e. Outside your MFG
> capability, better stay away OSP.
> --------------------------
> Sent using BlackBerry
>
>
> ----- Original Message -----
> From: TechNet <[log in to unmask]>
> To: [log in to unmask] <[log in to unmask]>
> Sent: Sun Nov 23 21:50:57 2008
> Subject: Re: [TN] black pad,Enigversus OSP
>
> And even then it does have problems
>
> Vladimir
>
> ----- Original Message -----
> From: TechNet <[log in to unmask]>
> To: [log in to unmask] <[log in to unmask]>
> Sent: Sun Nov 23 20:10:19 2008
> Subject: Re: [TN] black pad,Enigversus OSP
>
> Because it need excellent process control!
> --------------------------
> Sent using BlackBerry
>
>
> ----- Original Message -----
> From: TechNet <[log in to unmask]>
> To: [log in to unmask] <[log in to unmask]>
> Sent: Sun Nov 23 20:04:58 2008
> Subject: Re: [TN] black pad,Enigversus OSP
>
> I hear that OSP limitations are that since it is a coating, it is difficult
> to test
> since it is a non-conductive coating. Also, the test probes get gummed up
> with goo after a while.
> Can't be too bad though, the PS1 and PS2 PCB's use it and you don't get much
> higher volume than those.
> So then why do most people here not use it?
> Ken
>
> _____________________________________
> Kenneth J. Wood
> Saturn PCB Design, Inc. [log in to unmask]
> 2737 Bishop Lane phone:(407) 340-2668
> Deltona, Fl 32725 fax: (386) 789-2765
> www.saturnpcb.com
>
>
>
>
>
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of John Goulet
> Sent: Sunday, November 23, 2008 9:25 AM
> To: [log in to unmask]
> Subject: [SPAM]Re: [TN] black pad,Enigversus OSP
>
> OSP has more defects when soldering. You can't bake to remove moisture from
> vendor or stock room lack of control and not resealing. BY the time the SMT
> processes have finished their two thermal cycles and then hold it up in SMT
> rework or at the BGA rework areas the OSP preservative is at a minimum. We
> try to put practices in place where the SMT rework must be done after the
> last wave or selective solder process but for several reasons they don't.
> In the Pb-free soldering process the copper disolution issues and the fact
> that you can't tell if a location has already been reworked and the whole
> board is at risk with another component replacement makes the cost and
> reliability not even close to ENIG.
>
> -------------- Original message -------------- From: Joyce Koo <[log in to unmask]>
>
>> I would take OSP over enig in a heart beat! I guess Doug would jump out
> with ,
>> it depends,
>> -------------------------- Sent using BlackBerry
>>
>>
>> ----- Original Message ----- From: TechNet
>> To: [log in to unmask]
>> Sent: Sun Nov 23 08:48:56 2008
>> Subject: Re: [TN] black pad
>>
>> That was a very good explanation. With the advances in process controllers
> and
>> software I would think or expect that the ENIG process is less risky now
> than
>> some 10 years ago when I used to hear about these issues. I know from a
>> manufacturing poit I'll take ENIG over OSP any day.
>>
>> -------------- Original message -------------- From: Inge
>>
>>> Can we call it 'Black Pudding' instead, as it is a mess of obscure
>>> ingredients?
>>> Inge
>>>
>>>
>>> ----- Original Message ----- > From: "Wenger, George M."
>>> To:
>>> Sent: Friday, November 21, 2008 10:47 AM
>>> Subject: Re: [TN] black pad
>>>
>>>
>>> That is how a lot of the confusion around (I hate t
>>>
>>> Peter,
>>>
>>> That is how a lot of the confusion around (I hate the name but I need to
>
>>> use it here) Black Pad started. Creep fatigue cracking, brittle
>>> fracture, etc. are recognized failure modes or mechanisms, "Black Pad","
>
>>> Black Line Nickel", etc. are not names of recognized failure modes.
>>> They are names of what people see when they look at a failure. They
>>> are short cute names that people like to repeat but they don't help to
>>> describe what the failure is or what caused it. All I know about "Black
>>> Pad" is that it happens with ENIG, it's a low level problem that follows
>
>>> Murphy's Law (i.e., it happens when you least expect it and usually and
>>> an inappropriate time), it might be caused by a high P content at the
>>> interface, it might be caused by "weak" electroless nickel, it might be
>>> caused by cavitation and attack at grain boundaries, it might be cause
>>> by too much gold plating attaching the under lying nickel, it might be
>>> caused by board shops not controlling the ENIG process properly, etc.
>>> There are just too many "might". The data that has been generated by
>>> many over the last couple of years certainly shows that control of the
>>> plating chemistry is a key to reducing the occurrences of "Black Pad"
>>> failures and the number of occurrences has certainly decreased but the
>>> failures certainly have not been eliminated. Many of the ENIG failures
>>> I've seen over the years are fractures at an interface. Vladimir would
>>> certainly not agree with calling all ENIG failures "Black Pad" and I'd
>>> agree with him. I'd much rather refer to the ENIG failures as "ENIG
>>> Interface Failures" rather than "Black Pad" but that will never happen
>>> because "Black Pad" is a cute and short 8 letter name that can even be
>>> shorted to two ("BP"). It takes 23 key strokes to type "ENIG Interface
>>> failures".
>>>
>>>
>>> Sorry for the long answer but it's Friday and I had an exhausting week.
>>>
>>> Regards,
>>> George
>>> George M. Wenger
>>> Andrew Wireless Solutions
>>> Senior Principle FMA/Reliability Engineer
>>> 40 Technology Drive, Warren, NJ 07059
>>> (908) 546-4531 (Office) (732) 309-8964 (cell)
>>> [log in to unmask]
>>> -----Original Message----- > From: TechNet [mailto:[log in to unmask]]
>> On Behalf Of Pete Houwen
>>> Sent: Friday, November 21, 2008 12:54 PM
>>> To: [log in to unmask]
>>> Subject: Re: [TN] black pad
>>>
>>> not to step in a place I don't beloing, between werner and Vladimir, but
>
>>> how
>>> about "dark line defect" instead of "black pad"?
>>>
>>> Similar phenomenon for a different reason.
>>>
>>> We went through this a while ago, wondering why suddenly boards from a
>>> very
>>> good ENiG supplier were looking like black pad, all that P on top of the
>
>>> pad.
>>> Changing reflow profiles to reduce TAL and max temp, reducing rework
>>> cycles
>>> made it all go away. All that extra time at temperature just continued
>>> the
>>> Ni/Sn reaction, leaving P behind. Quantities of Ni in the Sn tipped us
>>> off that
>>> we weren't starting out with black pad, but we were ending up with it.
>>>
>>> I do get why people don't like ENiG, but we've done very well with it by
>
>>> making
>>> sure we use good suppliers.
>>>
>>> Pete
>>>
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