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From:
"Igoshev, Vladimir" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Igoshev, Vladimir
Date:
Fri, 21 Nov 2008 08:27:39 -0500
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That woud be a very good idea.



Vladimir



----- Original Message -----

From: TechNet <[log in to unmask]>

To: [log in to unmask] <[log in to unmask]>

Sent: Fri Nov 21 08:11:35 2008

Subject: Re: [TN] black pad





 I know, I know Vladimir,

but alas that is not my definition.

You reduce cavitation/corrosion you need to increase P, to reduce the classical 'Black Pad' you need to reduce P [by either less in the Ni layer and/or reducing number/length of soldering temperature exposure----so quite opposite remedies.

Maybe we need an IPC committee to officially define the situation.



Werner





 





 



-----Original Message-----

From: Igoshev, Vladimir <[log in to unmask]>

To: [log in to unmask]

Sent: Fri, 21 Nov 2008 7:57 am

Subject: Re: [TN] black pad





















Hi Werner,



As always, we are going to stick to our preferrences :-)



However, I'd like to highlight that in that ATOTECH paper I sent you a while ago 

stated that the presence of cavitation/corrosion in the layer of E-Ni is the 

major indicator of Black Pad.



Regards,



Vladimir



________________________________



From: [log in to unmask] 

To: Igoshev, Vladimir; [log in to unmask] 

Sent: Thu Nov 20 23:08:06 2008

Subject: Re: [TN] black pad 





Hi Vladimir,

No, I would not agree that the same phenomenological situation should get a 

different name, just because it is caused by a different set of inputs. [The 

solder joint with a fatigue crack is a fatigue failure whether the cause is 

thermo-mechanical loading or purely mechanical loading]. 



'Brittle fracture' as well as 'de-wetting' have already well understood meanings 

different from BP. However, brittle fracture includes BP as well as other 

brittle fractures resulting from other problems.



I=2

0would not call any problems resulting from electroless Ni plating with no or 

insufficient P 'Black Pad'--I have not seen a special name for tis situation.



Having a limited number of pads affected is pretty typical of 'Black Pad'; one 

requirement for BP is the presence of a NiSn-IMC layer. Typical BP does not show 

corrosion/cavitation.



Werner





-----Original Message-----

From: Igoshev, Vladimir <[log in to unmask]>

To: [log in to unmask]; [log in to unmask]

Sent: Thu, 20 Nov 2008 10:31 pm

Subject: Re: [TN] black pad





Good. And since we have agreed that different thenomenon (root causes) can cause 

almost identical appearance (Black), then would it be logical to use a different 

name for each of them (Black Pad; Brittle Fracture: Dewetting, etc.) .



Just to give an example, a few days ago I came accross two different problems 

with ENIG and I still don't know what had caused them (to be exact, I suspect 

the root cause in both cases is in the plating process).



The reason I mentioned about them is that both could have been easily (and 

wrongly) called Black Pad, as the pads were dark (as usual after joint is broken 

or not formed. However, in one case only limited numer of pads exhibited the 

problem, and the layer of E-Ni was not corroded/cavitated (ruling out Black Pad, 

as I understand it). In the second case, E-Ni had NO phosphorus in it (at least 

I couldn't detect it with EDS) and I know it was supposed to be Ni-P, not Ni-B.

U don't even know how to call that=2

0case, but definitely not Black Pad :-)



Regards,



Vladimir





----- Original Message -----

From: TechNet <[log in to unmask]>

To: [log in to unmask] <[log in to unmask]>

Sent: Thu Nov 20 18:17:42 2008

Subject: Re: [TN] black pad





 Agreed, the prescription for the fix will be different.



Werner















-----Original Message-----

From: Igoshev, Vladimir <[log in to unmask]>

To: [log in to unmask]

Sent: Thu, 20 Nov 2008 5:52 pm

Subject:20Re: [TN] black pad





















Hi Werner,



I completely agree on what we disagree on :-)



I think that the same appearnce can (and is in that particuar case) be caused by

completely different phenomena, therefore the recepie to fix/avoid it will be

different.



Regards,



Vladimir



----- Original Message -----

From: TechNet <[log in to unmask]>

To: [log in to unmask] <[log in to unmask]>

Sent: Thu Nov 20 17:28:06 2008

Subject: Re: [TN] black pad





 Hi Vladimir,

That is where we disagree--the definition of 'Black Pad.'

I define it as the phenomenon root cause regardless of what caused it--that is

not to say that who caused it is unimportant.



Werner















-----Original Message-----

From: Igoshev, Vladimir <[log in to unmask]>

To: [log in to unmask]

Sent: Thu, 20 Nov 2008 5:20 pm

Subject: RE: [TN] black pad



























































Hi Werner,







 



0A



I should have referred to your exact phrase,

so you wouldn’t have to correct me J







As far as the definition of BP is

concerned, then I still prefer to define it 

as a manufacturing defect, which

has nothing to do with the assembly process.







The presence of thicker P-enriched layer

isn’t a good thing but in true cases of BP it’s normal

(thickn

ess-wise) but the joints has almost zero strength.











Regards,







 







Vladimir







 

































From:

[log in to unmask] [mailto:[log in to unmask]]



Sent: Thursday, November 20, 2008

5:06 PM



To: [log in to unmask]; Igoshev,

Vladimir



Subject: Re: [TN] black pad













 













Hi Vladimir,



I did not say 'excessive temperature'-- I said 'the more you expose

an ENIG layer to soldering temperatures'--that means multiple or lengthy

exposures.



If you define 'Black Pad' as the presence of P at the Ni/NiSn-IMC interlayer to

a degree significantly weakening that i nterface, then you can arrive at that

condition by

 multiple paths.



One is faulty manufacturing, the other is excessive Ni-dissolution--of course,

these can work in combination.







Werner



















 



















 













-----Original

Message-----



From: Igoshev, Vladimir <[log in to unmask]>



To: [log in to unmask]



Sent: Thu, 20 Nov 2008 4:45 pm



Subject: Re: [TN] black pad









Well, with all due respect I would have to disagree with you Werner (not











for the first time :-)). I wouldn't associate Black Pad with excessive











soldering temperature. It's rather a board manufacturing related issue.























Regards,

























Vladimir























-----Original Message-----











From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*











Sent: Thursday, November 20, 2008 4:38 PM



0A





To: [log in to unmask]











Subject: Re: [TN] black pad



































 The more you expose an ENIG layer to soldering temperatures, the more











Ni dissolves leaving more P at the layer between the Ni and the











NiSn-IMC. The more? P the weaker this interface, leading to 'Black Pad'























Werner



































 



































 























-----Original Message-----











From: henry rekers <[log in to unmask]>











To: [log in to unmask]











Sent: Thu, 20 Nov 2008 3:41 pm











Subject: Re: [TN] black pad





=0

A





0A





















































































































Can you give me any examples of black pad being caused by anything other











than a











"bad board"? ie.? Is there anything in processing "perfect board" that











would











cause a de-wet condition that indicates black pad??? I guess where I'm











going is,











can this be anything other than a supplier issue?























--- On Thu, 11/20/08, Werner Engelmaier /* <[log in to unmask]> wrote:























From: Werner Engelmaier /* <[log in to unmask]>







=0

A

Subject: Re: [TN] black pad











To: [log in to unmask]





0A





Received: Thursday, November 20, 2008, 1:26 PM























 Hi 'rekers,'











You canno

t broad-brush like this. Some FAB houses do quite well, others











not.











ENIG, from various sources and at various conditions, has shown nickel











corrosion or high phosphide concentrations. The underlying reasons for











these are











different, actually diametrically opposed. Some are the fault of the FAB











house











others not.























Werner



































 



































 























-----Original Message-----











From: henry rekers <[log in to unmask]>











To: [log in to unmask]









Sent: Thu, 20 Nov 2008 12:45 pm





=0

A



Subject: [TN] black pad



































































































































Anybody out there experiencing mass dewetting issues from North American











board











shops?











?











From what I understand primary causes for dewetting (assuming the











reflow/wave











profile is bang on) is all on the board, ie nickel corrosion,











degeneration of











the nickel, or outgassing of the nickel/copper.? (I'm talking enig











here.)











?











Anybody?



































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