Thanks for the table.
-------------- Original message --------------
From: "Jeremias, Michael" <[log in to unmask]>
> This table seems very valuable.
> Pete , can You add additional information?
>
> Which board thicknesses are investigated?
> Which finishes are investigated?
>
> I attach the information of the SMTA-Paper, reporting some investigations on
> OSP-finish :
>
> IMPROVING HOLE-FILL IN LEAD-FREE SOLDERING OF THICK PRINTED CIRCUIT BOARDS WITH
> OSP FINISH
> Sanmina-SCI Corporation (LF2)
> from SMTA Conference 2008, Orlando, Florida, August 17 -21, 2008
>
>
> They told that they had a big rejection rate with OSP finish, where gap is
> less than 11,5 mils. This leads to different values to Your table?.
>
> Sincerly
>
> Michael Jeremias
> Industrial Engineering (OPPI41)
> Electronics Production
> ((( Defence Electronics
> EADS Deutschland GmbH
> 89077 Ulm
> Tel.: +49 (0) 7 31.3 92-5533
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>
> mailto: [log in to unmask]
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>
> -----Ursprüngliche Nachricht-----
> Von: TechNet [mailto:[log in to unmask]] Im Auftrag von Pete Houwen
> Gesendet: Mittwoch, 29. Oktober 2008 14:07
> An: [log in to unmask]
> Betreff: Re: [TN] How to improve solder filling and wetting contact angles for
> thermal vias at wave soldering process.
>
> We did some testing of design parameters when we switched to lead-free, and
> found that the lead-hole ratio is more critical. We also found that top side
> pad size is irrelevant for hole fill, but large bottom side pads can adversly
> affect hole fill. Using this chart, we are able to achieve 75% with regularity
> (and we do not have the best process controls in our plant):
>
> Lead Range Pad Size Hole Size
> .000-.017 0.05 0.026
> .018-.022 0.06 0.035
> .023-.027 0.07 0.04
> .028-.032 0.07 0.046
> .033-.042 0.08 0.052
> .043-.052 0.09 0.062
> .053-.063 0.1 0.073
> .064-.076 0.11 0.086
> .077-.086 0.12 0.096
> .087-.106 0.14 0.116
> .107-.115 0.15 0.125
> (dimensions in inches)
>
> standard plane connects are thermal relief, using (4) .008" spokes.
>
> This testing was done only to establish design parameters, there are plenty of
> process parameters that will affect hole fill. But if your design parameters
> aren't good, all the process tweaks in the world won't fix trhe problem.
>
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