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November 2008

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From:
kwood716 <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, kwood716 <[log in to unmask]>
Date:
Fri, 21 Nov 2008 08:13:22 -0500
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That's BIG PCB for ya...always taking advantage of the little guy.

I still don't get it though, I've never had an issue with gold finishes
Ken

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Friday, November 21, 2008 8:09 AM
To: [log in to unmask]
Subject: Re: [TN] black pad

Wow, you mean you see some hudge fund board shop? We need some regulation
before we hit a downfall like financial. 
--------------------------
Sent using BlackBerry


----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Fri Nov 21 08:00:01 2008
Subject: Re: [TN] black pad


Ingemar is correct.  A good working relationship with your board supplier
including continuous interactions and frequent inspection visits to insure
they are continuing to apply appropriate process controls should help
prevent many of the ENIG problems. However, if you follow TN closely you can
see a trend that ENIG problems are not going away.  They continue to cause
problems for many companies.  I believe that the primary reason for this is
that most board suppliers today are not next door to where you are doing
assembly and it is extremely costly in today's economy to have employees
traveling (sometimes half a world away) to check up on suppliers.  Also in a
lot of cases your board supplier may actually not be building your boards
but may have out sourced to a cheaper supplier which is making it much more
difficult to have confidence in the board fabrication process control.

One alternative is to switch to a surface finish that has less inherent
problems and doesn't require as much process control.

Regards,
George
George M. Wenger
Andrew Wireless Solutions
Senior Principal FMA / Reliability Engineer
40 Technology Drive, Warren, NJ 07059
(908) 546-4531 [Office]  (732) 309-8964 [Cell]
[log in to unmask]
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hernefjord Ingemar
Sent: Friday, November 21, 2008 2:49 AM
To: [log in to unmask]
Subject: Re: [TN] black pad

If you have a contiguos cooperation with your board supplier, i.e. frequent
visits to an inspections at their plant, I think you will not see much ENIG
problems. It's very much about good process continuity. I've said it before:
we have assembled millions of ENIG board without problems. We had some
issues many years ago, learned about the process and set up a cooperation
model. If ENIG was that bad, we had changed to something else, but it wasn't
necessary.
Inge 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of henry rekers
Sent: den 20 november 2008 18:46
To: [log in to unmask]
Subject: [TN] black pad

Anybody out there experiencing mass dewetting issues from North American
board shops?
 
From what I understand primary causes for dewetting (assuming the
reflow/wave profile is bang on) is all on the board, ie nickel corrosion,
degeneration of the nickel, or outgassing of the nickel/copper.  (I'm
talking enig here.)
 
Anybody?


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