Ingemar is correct. A good working relationship with your board supplier including continuous interactions and frequent inspection visits to insure they are continuing to apply appropriate process controls should help prevent many of the ENIG problems. However, if you follow TN closely you can see a trend that ENIG problems are not going away. They continue to cause problems for many companies. I believe that the primary reason for this is that most board suppliers today are not next door to where you are doing assembly and it is extremely costly in today's economy to have employees traveling (sometimes half a world away) to check up on suppliers. Also in a lot of cases your board supplier may actually not be building your boards but may have out sourced to a cheaper supplier which is making it much more difficult to have confidence in the board fabrication process control.
One alternative is to switch to a surface finish that has less inherent problems and doesn't require as much process control.
Regards,
George
George M. Wenger
Andrew Wireless Solutions
Senior Principal FMA / Reliability Engineer
40 Technology Drive, Warren, NJ 07059
(908) 546-4531 [Office] (732) 309-8964 [Cell]
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hernefjord Ingemar
Sent: Friday, November 21, 2008 2:49 AM
To: [log in to unmask]
Subject: Re: [TN] black pad
If you have a contiguos cooperation with your board supplier, i.e. frequent visits to an inspections at their plant, I think you will not see much ENIG problems. It's very much about good process continuity. I've said it before: we have assembled millions of ENIG board without problems. We had some issues many years ago, learned about the process and set up a cooperation model. If ENIG was that bad, we had changed to something else, but it wasn't necessary.
Inge
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of henry rekers
Sent: den 20 november 2008 18:46
To: [log in to unmask]
Subject: [TN] black pad
Anybody out there experiencing mass dewetting issues from North American board shops?
From what I understand primary causes for dewetting (assuming the reflow/wave profile is bang on) is all on the board, ie nickel corrosion, degeneration of the nickel, or outgassing of the nickel/copper. (I'm talking enig here.)
Anybody?
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