Hi Vladimir,
That is where we disagree--the definition of 'Black Pad.'
I define it as the phenomenon root cause regardless of what caused it--that is not to say that who caused it is unimportant.
Werner
-----Original Message-----
From: Igoshev, Vladimir <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, 20 Nov 2008 5:20 pm
Subject: RE: [TN] black pad
Hi Werner,
I should have referred to your exact phrase,
so you wouldn’t have to correct me J
As far as the definition of BP is
concerned, then I still prefer to define it as a manufacturing defect, which
has nothing to do with the assembly process.
The presence of thicker P-enriched layer
isn’t a good thing but in true cases of BP it’s normal
(thickness-wise) but the joints has almost zero strength.
Regards,
Vladimir
From:
[log in to unmask] [mailto:[log in to unmask]]
Sent: Thursday, November 20, 2008
5:06 PM
To: [log in to unmask]; Igoshev,
Vladimir
Subject: Re: [TN] black pad
Hi Vladimir,
I did not say 'excessive temperature'-- I said 'the more you expose
an ENIG layer to soldering temperatures'--that means multiple or lengthy
exposures.
If you define 'Black Pad' as the presence of P at the Ni/NiSn-IMC interlayer to
a degree significantly weakening that interface, then you can arrive at that
condition by
multiple paths.
One is faulty manufacturing, the other is excessive Ni-dissolution--of course,
these can work in combination.
Werner
-----Original
Message-----
From: Igoshev, Vladimir <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, 20 Nov 2008 4:45 pm
Subject: Re: [TN] black pad
Well, with all due respect I would have to disagree with you Werner (not
for the first time :-)). I wouldn't associate Black Pad with excessive
soldering temperature. It's rather a board manufacturing related issue.
Regards,
Vladimir
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Thursday, November 20, 2008 4:38 PM
To: [log in to unmask]
Subject: Re: [TN] black pad
The more you expose an ENIG layer to soldering temperatures, the more
Ni dissolves leaving more P at the layer between the Ni and the
NiSn-IMC. The more? P the weaker this interface, leading to 'Black Pad'
Werner
-----Original Message-----
From: henry rekers <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, 20 Nov 2008 3:41 pm
Subject: Re: [TN] black pad
=0
A
Can you give me any examples of black pad being caused by anything other
than a
"bad board"? ie.? Is there anything in processing "perfect board" that
would
cause a de-wet condition that indicates black pad??? I guess where I'm
going is,
can this be anything other than a supplier issue?
--- On Thu, 11/20/08, Werner Engelmaier /* <[log in to unmask]> wrote:
From: Werner Engelmaier /* <[log in to unmask]>
Subject: Re: [TN] black pad
To: [log in to unmask]
Received: Thursday, November 20, 2008, 1:26 PM
Hi 'rekers,'
You cannot broad-brush like this. Some FAB houses do quite well, others
not.
ENIG, from various sources and at various conditions, has shown nickel
corrosion or high phosphide concentrations. The underlying reasons for
these are
different, actually diametrically opposed. Some are the fault of the FAB
house
others not.
Werner
-----Original Message-----
From: henry rekers <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, 20 Nov 2008 12:45 pm
=0
A
Subject: [TN] black pad
Anybody out there experiencing mass dewetting issues from North American
board
shops?
?
From what I understand primary causes for dewetting (assuming the
reflow/wave
profile is bang on) is all on the board, ie nickel corrosion,
degeneration of
the nickel, or outgassing of the nickel/copper.? (I'm talking enig
here.)
?
Anybody?
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