The more you expose an ENIG layer to soldering temperatures, the more Ni dissolves leaving more P at the layer between the Ni and the NiSn-IMC. The more? P the weaker this interface, leading to 'Black Pad'
Werner
-----Original Message-----
From: henry rekers <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, 20 Nov 2008 3:41 pm
Subject: Re: [TN] black pad
Can you give me any examples of black pad being caused by anything other than a
"bad board"? ie.? Is there anything in processing "perfect board" that would
cause a de-wet condition that indicates black pad??? I guess where I'm going is,
can this be anything other than a supplier issue?
--- On Thu, 11/20/08, Werner Engelmaier /* <[log in to unmask]> wrote:
From: Werner Engelmaier /* <[log in to unmask]>
Subject: Re: [TN] black pad
To: [log in to unmask]
Received: Thursday, November 20, 2008, 1:26 PM
Hi 'rekers,'
You cannot broad-brush like this. Some FAB houses do quite well, others not.
ENIG, from various sources and at various conditions, has shown nickel
corrosion or high phosphide concentrations. The underlying reasons for these are
different, actually diametrically opposed. Some are the fault of the FAB house
others not.
Werner
-----Original Message-----
From: henry rekers <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, 20 Nov 2008 12:45 pm
Subject: [TN] black pad
Anybody out there experiencing mass dewetting issues from North American board
shops?
?
From what I understand primary causes for dewetting (assuming the reflow/wave
profile is bang on) is all on the board, ie nickel corrosion, degeneration of
the nickel, or outgassing of the nickel/copper.? (I'm talking enig here.)
?
Anybody?
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