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November 2008

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Subject:
Re: AgPdPt-glass frit?
From:
"David D. Hillman" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 19 Nov 2008 07:16:49 -0600
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Hi Ben! The Ag-Pd-Pt termination combination has some of the same issues 
as a Ag-Pd termination - solderability use life and dissolution in the 
soldering process (aka leachability). However, the addition of Pt slightly 
improves both the solderability and dissolution characteristics of the 
finish. If your process adequately addresses both solderability and 
dissolution issues for an Ag-Pd termination then you should have any 
additional issues with the Ag-Pd-Pt termination combination. There has 
been a trend for more component fabricators to use the Ag-Pd and Ag-Pd-Pt 
finish with the implementation of the RoHS Directive requirements.

Dave Hillman
Rockwell Collins
[log in to unmask]



"Gumpert, Ben" <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
11/18/2008 09:39 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
"Gumpert, Ben" <[log in to unmask]>


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Subject
[TN] AgPdPt-glass frit?






Technetters,

Anyone heard of a silver-palladium-platinum-glass frit finish on a
component?
(See http://www.coilcraft.com/1008ls.cfm )

Do the same issues with Ag and AgPd finishes apply?
Should I be concerned about using this in a SnPb process?

Ben

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