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November 2008

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Subject:
From:
"Whittaker, Dewey (EHCOE)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (EHCOE)
Date:
Wed, 19 Nov 2008 06:37:39 -0700
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Especially behind the ears.
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Brian Ellis
Sent: Wednesday, November 19, 2008 4:18 AM
To: [log in to unmask]
Subject: Re: [TN] WS solder paste

Choosing the paste is the easy part. Choosing the cleaning process and 
cleaning/drying equipment is the hard part. Do not forget that the 
drying part of the process is every bit as important as the
washing/rinsing.

Brian

Ioan Tempea wrote:
> Dear Technos,
> 
>  
> 
> After having worked for years with no-clean pastes, I need now to
> evaluate water soluble. Concerning both SnPb and lead-free, what would
> be your short list to start qualifications?
> 
>  
> 
> We are a CEM, so the paste needs to be very versatile, so it can give
> the best performance (compromise) for inconsistent designs. In this
> world we need to print everyday a wide range of designs like 20mil
fine
> pitch pads with widths from 9 to 15 mils, 0603s with pad gaps between
20
> and 35 mils, etc., so I guess most of you understand what I mean by
> versatile ;-)
> 
>  
> 
> I assume off-line answers would be appropriate, so please do not
> hesitate...
> 
>  
> 
> Thank you,
> 
>  
> 
> Ioan
> 
> 
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