It is not only a decision to be class 3.

It’s a logistic, shorten time to production from producing the components and PCBs.

Accuracy of placement machines (less shift)

Through holes solder fillets to be higher

Less % Voids in solder joints

More time in Process and rework

Etc. 





Best Regards



Reuven ROKAH 

Think green before printing this mail... Thanks



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Rudolph yu

Sent: Wednesday, November 19, 2008 6:45 AM

To: [log in to unmask]

Subject: [TN] IPC class 3 requirements??



Besides of meeting the class 3 solder joints crtieria per the IPC workshipment standards, what else will a company need to do / meet in order to claim its products as class 3 instead of class 2?

 

Recently one of our customers requested us to build their prodcut to the class 3 std.  (only IPC-610, PCB can be fabricated at class2 per IPC-600)

 

Since the design only has BGA ( which share the same crtieria between class2 and class3), TSOP, and 0402 part, process-wise we should be able to achieve the tighten tolerence.  However is there other areas ( besides pure workmanship) I need to be aware of before we go out and claim that we can build and ship products as class 3?  Our company had only built to class 2 in the pass.

 

Also, how much more should we charge the customer in % now that we need to build the same product from class 2 to class 3?

It seems that the stencil is the only thing we will need to change for the purpose. 

 

Thanks

Rudolph 

 



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