If you have very good clean system. Excellent process control, I.e. Always clean your board within , say 20min. You have many wonderful choice! Oh don't forget short time between pick and place to reflow, and control rh of environment. You can get away with rh, if you control very short process window .
--------------------------
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----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Tue Nov 18 22:44:00 2008
Subject: [TN] WS solder paste
Dear Technos,
After having worked for years with no-clean pastes, I need now to
evaluate water soluble. Concerning both SnPb and lead-free, what would
be your short list to start qualifications?
We are a CEM, so the paste needs to be very versatile, so it can give
the best performance (compromise) for inconsistent designs. In this
world we need to print everyday a wide range of designs like 20mil fine
pitch pads with widths from 9 to 15 mils, 0603s with pad gaps between 20
and 35 mils, etc., so I guess most of you understand what I mean by
versatile ;-)
I assume off-line answers would be appropriate, so please do not
hesitate...
Thank you,
Ioan
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