Besides of meeting the class 3 solder joints crtieria per the IPC workshipment standards, what else will a company need to do / meet in order to claim its products as class 3 instead of class 2?
 
Recently one of our customers requested us to build their prodcut to the class 3 std.  (only IPC-610, PCB can be fabricated at class2 per IPC-600)
 
Since the design only has BGA ( which share the same crtieria between class2 and class3), TSOP, and 0402 part, process-wise we should be able to achieve the tighten tolerence.  However is there other areas ( besides pure workmanship) I need to be aware of before we go out and claim that we can build and ship products as class 3?  Our company had only built to class 2 in the pass.
 
Also, how much more should we charge the customer in % now that we need to build the same product from class 2 to class 3?
It seems that the stencil is the only thing we will need to change for the purpose. 
 
Thanks
Rudolph 
 

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