Ben,

The Ag-Pt-Pd is a standard thick-film metallization.  In this case it is
frit [glass] bonded and not chemically bonded.  Old and rugged!

Used in all manner of solderable thick film hybrids for many many years.

There are some cases where it may difficult to wet to, but I can not
imagine that you will have any problem unless the terminations are all
tarnished up, or you are using a non-activated flux.

The Ag-Pd is a relatively highly wettable termination with decent leach
resistance.  Adding a smidgen of Pt greatly increases leach RESISTANCE,
but may also add a touch of wetting difficulty.

As your reflow temps go up, I suggest that you are far better off with
the Ag-Pd-Pt termination than the standard Ag-Pd.


My two bits

Steve

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gumpert, Ben
Sent: Tuesday, November 18, 2008 10:39 AM
To: [log in to unmask]
Subject: [TN] AgPdPt-glass frit?

Technetters,

Anyone heard of a silver-palladium-platinum-glass frit finish on a
component?
(See http://www.coilcraft.com/1008ls.cfm )

Do the same issues with Ag and AgPd finishes apply?
Should I be concerned about using this in a SnPb process?

Ben
 
 
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