We are creating a small (20x30mm) radio module that is intended to be
surface mounted on other PC boards.  We are using surface mounted parts
on only one side, with "half pads" around the edges for our contact
points.  The "half pads" have plating in the "half vias", and have
plating on the top and bottom of the board to allow for inspection of
the mounted solder joints.  The board will probably be made of 0.032"
FR-4, and will have a metal shield covering most of the top side of the
board.  We are planning on RoHS compliance. 

I have seen other small RF modules that were built like this.  I am
hoping to learn where the problems might be hiding, from people who have
"been there, done that".

I am looking for guidance for the following issues:
1. How do we maintain co-planarity for our board? (to allow for reliable
soldering to the target PC board)
2. Is special processing needed for our board? (since it will go through
another surface mount process when mounted on the target PC board)
3. Is special solder needed for our assembly? (high temperature?)
4. Is there any way to design the board to aid the cleaning process,
after it is mounted to the target PC board? (slots, risers, etc.?)
5. What other things should I worry about?

Thanks,
Carl





Carl Van Wormer, P.E.
Senior Hardware Engineer
Cipher Systems
1800 NW 169th Place, Suite B-100
Beaverton, OR  97006
Cipher Systems (503) 617-7447   
Direct Line (503) 425-5163

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