Hi Mike,
Given that SAC+Bi solders outperform SAC, I assumed, it sounds like incorrectly, that there would be a reduction in modulus of elasticity.
Werner
-----Original Message-----
From: Mike Fenner <[log in to unmask]>
To: [log in to unmask]
Sent: Fri, 14 Nov 2008 9:10 am
Subject: RE: [TN] BGA Pad Cratering - PbFree
Werner
Generally I would not regard Bi based alloys as soft/ductile, do you have a
specific one in mind? Bi has all the same properties as a ginger biscuit
[except it doesn't go soggy if dunked in your tea].
Regards
Mike
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Thursday, November 13, 2008 4:16 PM
To: [log in to unmask]
Subject: Re: [TN] BGA Pad Cratering - PbFree
Hi Glenn,
Indeed, there are solution options.
First, easiest and most obvious, reduce cooling rate from reflow to
1.5°C/sec or less;
Second, use high STII-value (Tg, Td, TE) PCB base materials, however be
careful, some of these materials are more brittle;
Third, use softer solder alloys (Bi, In);
And fourth, to be facetious, use SnPb solders.
Werner
-----Original Message-----
From: Glenn Torrance (gtorranc) <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, 13 Nov 2008 9:00 am
Subject: [TN] BGA Pad Cratering - PbFree
Hi,
Anyone have any luck in mitigating Pad Cratering in the BGAs in a Pbfree
process ?
I heard enlarging pads might be a consideration.
Thanks in advan
ce,
Glenn
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