Hi Glenn,
Indeed, there are solution options.
First, easiest and most obvious, reduce cooling rate from reflow to 1.5°C/sec or less;
Second, use high STII-value (Tg, Td, TE) PCB base materials, however be careful, some of these materials are more brittle;
Third, use softer solder alloys (Bi, In);
And fourth, to be facetious, use SnPb solders.
Werner
-----Original Message-----
From: Glenn Torrance (gtorranc) <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, 13 Nov 2008 9:00 am
Subject: [TN] BGA Pad Cratering - PbFree
Hi,
Anyone have any luck in mitigating Pad Cratering in the BGAs in a Pbfree
process ?
I heard enlarging pads might be a consideration.
Thanks in advance,
Glenn
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