Hi,
We are using a 1.6mm FR4 material PWB. This PWB is held onto the plastic base with 2 hook and 2 snaps. We have 10 localised point on the board for the FFT testing.
The overall force of the 10 pogo pins which is applied from below on the PWB during testing is 3KgF.
We have 2 nos. of 0603 capacitor sitting on the other side of the board directly above these test points. We are seeing some displacement of the PWB when the pogo pin force is applied.
The query is would this force cause the capcitor crack or solder joint crack of the 0603 part? Does anyone have the data as to how much stress or strain on the 0603 part will cause it to have the crack on the component or solder crack. The component is ROHS and paste is leaded.
Thanks in advance to everyone for the inputs.
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