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November 2008

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Subject:
From:
Werner Engelmaier /* <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 7 Nov 2008 17:15:15 EST
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Hi all,
Just to let everybody know, I have developed a creep-fatigue model for 
SAC405/305 solder joints. It will be published in a presentation at the IPC/JEDEC 
Conference on Transitioning to Lead-Free: Strategies for Implementation on 
December 8 to 10, 2008 in Dallas, TX.

Werner
Future workshops:
Pb-Free Soldering Processes: Survival, Quality, Reliability—The PROBLEMS, 
December 8, Dallas, Texas
Pb-Free Soldering Processes: Survival, Quality, Reliability—The SOLUTIONS, 
December 8, Dallas, Texas
Solder Joint Reliability: Part 1—Solder Joint Reliability Fundamentals, March 
29, Las Vegas
Pb-Free Soldering Processes: Survival, Quality, Reliability: The PROBLEMS, 
March 30, Las Vegas
Pb-Free Soldering Processes: Survival, Quality, Reliability: The SOLUTIONS, 
March 30, Las Vegas



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