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Subject:	Call for Participation - IPC International Conference on Flexible Circuits 2009
From:	Michelle Michelotti <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Michelle Michelotti <[log in to unmask]>
Date:	Thu, 6 Nov 2008 13:23:12 -0600
Content-Type:	text/plain
Parts/Attachments:	text/plain (1 lines)

CALL FOR PARTICIPATION

IPC International Conference on Flexible Circuits

April 21-22, 2009 ♦ Minneapolis, MN

Participate in the electronic interconnection industry’s most important forum dedicated exclusively to flex circuitry. Over the years, the IPC International Conference on Flexible Circuits has drawn hundreds of users, manufacturers and suppliers of flex from across the United States and around the globe. IPC’s 2009 event promises another outstanding opportunity to learn and contribute to the flex industry.

Presentations for the technical conference are sought in all areas including:

New Product Applications

Global Market Trends

Design Strategies for Flex

Material Alternatives

Processing Innovations

Fine Line Flex—Increasing Interconnect Density

Flex Assembly

Flex and Lead Free

Fine Pitch and High Density Packaging for Flex

Reliability and Testing Data

This conference offers time slots between 30-45 minutes long. Some presentations may be grouped together in a forum or panel discussion. To submit an abstract, please go to www.ipc.org/FlexCFP2009<http://www.ipc.org/FlexCFP2009> and include an abstract of 200-300 words along with a brief biography or you may provide the same information via e-mail to [log in to unmask]<mailto:[log in to unmask]>.

Presentation materials must be non-commercial in nature, focusing on technology rather than a company’s product.

EDUCATIONAL COURSES

Proposals are also solicited from individuals interested in teaching half-day workshops (three hours) to and a class of up to 30 persons on topics in the field. Examples include; fine pitch advanced packaging, process issues, flex HDI for CSP application. Additional suggestions are also welcome. To submit an course proposal, please go to www.ipc.org/FlexCFP2009<http://www.ipc.org/FlexCFP2009> and include an course proposal along with a brief biography or you may provide the same information via e-mail to [log in to unmask]<mailto:[log in to unmask]>.

Abstracts and Course proposals are due by December 1, 2008. If you have any questions, please contact Michelle Michelotti at +1 847-597-2822 or via email at [log in to unmask]<mailto:[log in to unmask]>

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