LS,
Thanks for your input, is it possible to have an IPC reference for this
statement, currently, our customer is saying the attachment for the angular
ring is acceptable, we need reference to override their comment. This ring
will certainly impact the solder join quality.
Thanks...Kang
-----Original Message-----
From: Leesha Peng [mailto:[log in to unmask]]
Sent: Sunday, November 09, 2008 12:24 PM
To: MTD-AD4/AD5 Wei Jian Kang
Subject: 答复: [TGAsia] FW: Width of solder pad specification
标准中关于Annular ring的要求一般是为了电气特性而规定的。
如果你图片上的镀敷孔是为了机械安装用的，则不能套用标准中的annular ring的要
求。
Best Regards
Leesha Peng 彭丽霞
General Manager 总经理
IPC China
上海市长宁区延安西路1088号2303室
Suite 2303，#1088 West Yan'an Rd., Changning, Shanghai 200052 PRC
Tel: +86 21 54973435
Fax:+86 21 54973437
MP: +86 139 0299 4705
[log in to unmask]<mailto:[log in to unmask]>
www.ipc.org.cn<http://www.ipc.org.cn>
________________________________
发件人: TGAsia [[log in to unmask]] 代表 MTD-AD4/AD5 Wei Jian Kang [[log in to unmask]
COM.CN]
发送时间: 2008年11月7日 2:27
收件人: [log in to unmask]
主题: Re: [TGAsia] FW: Width of solder pad specification
Hi,
As per our understanding, the mininmum angular is between 0.03 -- 0.15mm.
Please advice. And also could you send us the Chinese version of this copy?
Should the angular from the attached jpg is acceptable to hold for a heat
sink?
Look forward of your prompt feedback.
Thanks.........Kang.
________________________________
From: QA-Jim [mailto:[log in to unmask]]
Sent: Friday, November 07, 2008 1:08 PM
To: Asia Committe Task Group Forum; MTD-AD4/AD5 Wei Jian Kang
Subject: Re: [TGAsia] FW: Width of solder pad specification
Hi All
Please find attached file.
Best Regards,
Jim
----- Original Message -----
From: MTD-AD4/AD5 Wei Jian Kang<mailto:[log in to unmask]>
To: [log in to unmask]<mailto:[log in to unmask]>
Sent: Friday, November 07, 2008 12:08 PM
Subject: Re: [TGAsia] FW: Width of solder pad specification
Hi,
Please send us the copy of Section 9.1: Gerneral Requirements for Lands with
Holes for our further study.
Thanks......Kang
________________________________
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Lu Yao
Sent: Friday, November 07, 2008 11:34 AM
To: [log in to unmask]<mailto:[log in to unmask]>
Subject: Re: [TGAsia] FW: Width of solder pad specification
Hello, Wei Jian Kang
Suppose the minimum standard fabrication allowance is Level A and the copper
weight is 1OZ. For the external supported hole (120mils), the worst-case land
size is 146mils. Please be aware that the land is not include the influence
of etchback.
You can find the details in the IPC-2221 (Section 9.1: Gerneral Requirements
for Lands with Holes).
Best Regards
Lucas Yao (姚鲁)
PCB Dept. Manager
Emerson Industrial Automation China
Tel: 86-755-8601-1568 Fax: 86-755-8601-0261
Mailto: [log in to unmask]<mailto:[log in to unmask]>
Website:
www.emersonnetworkpower.com.cn<http://www.emersonnetworkpower.com.cn/>
*****************************************************************************
*****************************************************************************
******************************************
This email message, including any attachments, is for the sole use of the
intended recipient(s) and may contain confidential and privileged information
from Emerson Network Power Co., Ltd. or its affiliates and subsidiaries. If
you have received it in error, you are hereby notified that review, use,
disclosure or distribution of this message is prohibited. Please advise the
sender by reply e-mail and immediately delete the message and any attachments
without copying or disclosing the contents. Thank you.
*****************************************************************************
*****************************************************************************
******************************************
MTD-AD4/AD5 Wei Jian Kang <[log in to unmask]> Sent by: TGAsia
<[log in to unmask]>
2008-11-04 17:19
Please respond to
Asia Committe Task Group Forum <[log in to unmask]>; Please respond to
MTD-AD4/AD5 Wei Jian Kang <[log in to unmask]>
To
[log in to unmask]
cc
Subject
[TGAsia] FW: Width of solder pad specification
Dear ..
This is QE of DEFOND Ltd. In Dong Guan city, I am Ken Yang Zhi Zhong. We are
encountering a problem that the PCB lay out solder pad ring width is just
10mils around hole and the through hole is 120mils, please see attached
photo. Such design caused the solering component (heat sink) loose easily,
solerable area is too small to fix the heat sink lead firmly. But we don't
know if such PCB hole pad design is okay, and which standard we can apply.
Thanks and best regards
Ken Yang
**********************************************************************
This e-mail and any attachments may contain information which is
confidential, privileged, and proprietary or otherwise protected by law. The
information is solely intended for the named addressee (or a person
responsible for delivering it to the addressee). If you are not the intended
recipient of this message, you are not authorized to read, print, retain,
copy or disseminate this message or any part of it. If you have received
this e-mail in error, please notify the sender immediately by return e-mail
and delete it from your computer. Our company accepts no liability for the
content of this email, or for the consequences of any actions taken on the
basis of the information provided, unless that information is subsequently
confirmed in writing.
**********************************************************************
|
